JPS5440236A - Plating process - Google Patents

Plating process

Info

Publication number
JPS5440236A
JPS5440236A JP10644677A JP10644677A JPS5440236A JP S5440236 A JPS5440236 A JP S5440236A JP 10644677 A JP10644677 A JP 10644677A JP 10644677 A JP10644677 A JP 10644677A JP S5440236 A JPS5440236 A JP S5440236A
Authority
JP
Japan
Prior art keywords
coupling agent
plated
allowed
functional group
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10644677A
Other languages
Japanese (ja)
Other versions
JPS5952701B2 (en
Inventor
Hiroshi Yubi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10644677A priority Critical patent/JPS5952701B2/en
Publication of JPS5440236A publication Critical patent/JPS5440236A/en
Publication of JPS5952701B2 publication Critical patent/JPS5952701B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

PURPOSE: To easily form a plated film of high adhesion strength by coating the surface of a layer to be plated with a silance coupling agent having hydrophilic chelate-forming active functional group in its molecule, followed by electroless plating.
CONSTITUTION: A layer such as glass to be plated is dipped for severalWseveral tens sec in a soln. of a silance coupling agent of formula NH2-R-Si(OR')3 (where R is 3W5 C and the atomic ratio of N:C-1:3 or more) having-NH2 at the end, whereby the agent release R'OH to provide the highly hydrophilic active properties of the functional group-NH2 to the oxide surface. So, adhesion of Pd particles or the like to be allowed to adhere in plating pretreatment is facilitated and Pd forms chelate. Accordingly, a film formed by next electroless plating is allowed to firmly adhere to the oxide through the coupling agent.
COPYRIGHT: (C)1979,JPO&Japio
JP10644677A 1977-09-05 1977-09-05 Metsuki method Expired JPS5952701B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10644677A JPS5952701B2 (en) 1977-09-05 1977-09-05 Metsuki method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10644677A JPS5952701B2 (en) 1977-09-05 1977-09-05 Metsuki method

Publications (2)

Publication Number Publication Date
JPS5440236A true JPS5440236A (en) 1979-03-29
JPS5952701B2 JPS5952701B2 (en) 1984-12-21

Family

ID=14433835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10644677A Expired JPS5952701B2 (en) 1977-09-05 1977-09-05 Metsuki method

Country Status (1)

Country Link
JP (1) JPS5952701B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182961A (en) * 1983-03-31 1984-10-17 Agency Of Ind Science & Technol Production of inorganic powder having metallic film
JP2000204479A (en) * 1999-01-14 2000-07-25 Ritsumeikan Method for forming three-dimensional device structure
WO2006027947A1 (en) * 2004-09-10 2006-03-16 Nippon Mining & Metals Co., Ltd. Electroless gold plating pretreatment agent and copper clad laminate for flexible board
JP2010168612A (en) * 2009-01-21 2010-08-05 Fujitsu Ltd Method for manufacturing electroless-plated product
WO2020031997A1 (en) * 2018-08-07 2020-02-13 株式会社豊光社 Plated glass substrate manufacturing method and glass substrate
CN114105494A (en) * 2021-10-22 2022-03-01 北京科技大学 Coupling agent compounded ionic nickel palladium-free activation solution and method for preparing conductive basalt fiber

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164504A (en) * 1986-12-25 1988-07-07 A T R Koudenpa Tsushin Kenkyusho:Kk Semiconductor device
JP5855363B2 (en) * 2011-06-15 2016-02-09 株式会社Adeka Organosilicon compound and electroless plating pretreatment method using the organosilicon compound
JP6471392B2 (en) 2015-02-12 2019-02-20 上村工業株式会社 Pretreatment agent for electroless plating, pretreatment method for printed wiring board using said pretreatment agent for electroless plating, and method for producing the same
JP6701630B2 (en) * 2015-06-02 2020-05-27 日立化成株式会社 Thermosetting resin composition, prepreg, laminated board and printed wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182961A (en) * 1983-03-31 1984-10-17 Agency Of Ind Science & Technol Production of inorganic powder having metallic film
JP2000204479A (en) * 1999-01-14 2000-07-25 Ritsumeikan Method for forming three-dimensional device structure
WO2006027947A1 (en) * 2004-09-10 2006-03-16 Nippon Mining & Metals Co., Ltd. Electroless gold plating pretreatment agent and copper clad laminate for flexible board
JP2010168612A (en) * 2009-01-21 2010-08-05 Fujitsu Ltd Method for manufacturing electroless-plated product
WO2020031997A1 (en) * 2018-08-07 2020-02-13 株式会社豊光社 Plated glass substrate manufacturing method and glass substrate
JP2020023734A (en) * 2018-08-07 2020-02-13 株式会社豊光社 Method for producing plated glass substrate
CN114105494A (en) * 2021-10-22 2022-03-01 北京科技大学 Coupling agent compounded ionic nickel palladium-free activation solution and method for preparing conductive basalt fiber
CN114105494B (en) * 2021-10-22 2022-10-04 北京科技大学 Coupling agent compound ionic nickel palladium-free activation solution and method for preparing conductive basalt fiber

Also Published As

Publication number Publication date
JPS5952701B2 (en) 1984-12-21

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