JPS5620192A - Plating method for thick film paste - Google Patents
Plating method for thick film pasteInfo
- Publication number
- JPS5620192A JPS5620192A JP9470879A JP9470879A JPS5620192A JP S5620192 A JPS5620192 A JP S5620192A JP 9470879 A JP9470879 A JP 9470879A JP 9470879 A JP9470879 A JP 9470879A JP S5620192 A JPS5620192 A JP S5620192A
- Authority
- JP
- Japan
- Prior art keywords
- film
- gold
- pasted
- substrate
- adhesive force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 5
- 239000010931 gold Substances 0.000 abstract 5
- 229910052737 gold Inorganic materials 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- 229910000679 solder Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To obtain plated film having a good workability and not diffusing in solder, by applying a fixed plating on a fixed gold pasted pattern which is provided on the insulation substrate through the gold pasted film losing the adhesive force by plating solution.
CONSTITUTION: The thick film gold pasted patterns 2... which do not lose the adhesive force even imprognated in plating solution, are formed on the alumina the alumina ceramic substrate 1. Next, the gold pasted film 3 which loses the adhesive force by the plating solution, is formed on the pattern 2 and substrate 1 and are connected in common. Then, the substrate 1 is immersed in copper sulfate plating solution and is electroplated and then, the copper film 4 difficult to diffuse for solder, is deposited on the film 3. Next, the gold pasted film part lost the adhesive force which is directly connected with the substrate 1, is removed and plural individual patterns 5... covered by copper, are obtained. Further, nickel can be used for difficult diffusible metal for the solder.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9470879A JPS5938314B2 (en) | 1979-07-25 | 1979-07-25 | Method of plating thick film paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9470879A JPS5938314B2 (en) | 1979-07-25 | 1979-07-25 | Method of plating thick film paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5620192A true JPS5620192A (en) | 1981-02-25 |
| JPS5938314B2 JPS5938314B2 (en) | 1984-09-14 |
Family
ID=14117652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9470879A Expired JPS5938314B2 (en) | 1979-07-25 | 1979-07-25 | Method of plating thick film paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938314B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000038685A (en) * | 1998-06-27 | 2000-02-08 | Micronas Intermetall Gmbh | How to coat a substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201413U (en) * | 1985-06-04 | 1986-12-17 |
-
1979
- 1979-07-25 JP JP9470879A patent/JPS5938314B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000038685A (en) * | 1998-06-27 | 2000-02-08 | Micronas Intermetall Gmbh | How to coat a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5938314B2 (en) | 1984-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0177686A3 (en) | Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby | |
| JPS53122790A (en) | Aluminum terminal and preparation | |
| JPS54100931A (en) | Electroless nickel plating | |
| ES8301556A1 (en) | A method for applying an anti-reflection coating and an electrode to a solar cell | |
| JPS5521536A (en) | Method of forming partial nickel layer | |
| JPS53112229A (en) | Partial electroless plating method | |
| JPS5469531A (en) | Selfflubricating composite plating solution * composite plating method using same and composite plated coating | |
| JPS5524477A (en) | Integrated circuit | |
| JPS5644790A (en) | Preparation of contact | |
| JPS5266374A (en) | Galvanization of non electrolytic nickel for semiconductor substrate | |
| JPS565997A (en) | Manufacture of hard gold alloy coating | |
| GB2127854B (en) | Selective plating | |
| JPS648601A (en) | Manufacture of electrode layer of chip resistance for surface mounting | |
| JPS53126267A (en) | Production of carrier tape | |
| JPS5380161A (en) | Electrode formation of semiconductor | |
| JPS5460557A (en) | Solder electrode forming method | |
| JPS53131235A (en) | Manufacture of one-side plated strip steel sheet | |
| JPS6420696A (en) | Manufacture of film carrier board | |
| JPS54126468A (en) | Production of resin-sealed semiconductor device | |
| JPS547862A (en) | Electrode forming method | |
| JPS5543818A (en) | Photo-resist mask manufacturing method | |
| JPS57177970A (en) | External parts for watch | |
| JPS555173A (en) | Brazing method by nickel-phosphorus alloy | |
| JPS5586115A (en) | Electrode formation | |
| JPS54107671A (en) | Manufacture for semiconductor device |