JPS5445800A - Thick film dielectric paste - Google Patents

Thick film dielectric paste

Info

Publication number
JPS5445800A
JPS5445800A JP11166677A JP11166677A JPS5445800A JP S5445800 A JPS5445800 A JP S5445800A JP 11166677 A JP11166677 A JP 11166677A JP 11166677 A JP11166677 A JP 11166677A JP S5445800 A JPS5445800 A JP S5445800A
Authority
JP
Japan
Prior art keywords
powder
thick film
dielectric
depolymeric
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11166677A
Other languages
Japanese (ja)
Other versions
JPS6052529B2 (en
Inventor
Kazuo Nate
Kyoko Kozuka
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11166677A priority Critical patent/JPS6052529B2/en
Publication of JPS5445800A publication Critical patent/JPS5445800A/en
Publication of JPS6052529B2 publication Critical patent/JPS6052529B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Inorganic Insulating Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE: To prevent residual carbon in a sintered film to improve dielectric characteristic by adding organic solvent which suspends depolymeric polymer to the mixture of dielectric powder and glass powder.
CONSTITUTION: Mixed powder, 60-90 wt.%, which consists of one kind of powder selected from dielectric powder or crystalline glass powder and semi-melted raw material of glass powder is added to organic solvent, 10-40 wt.%, which suspends depolymeric polymer to mix together. This solution consists of 5-40 wt.% of depolymeric polymer and 60-95 wt.% of organic solvent. The mixture, then, is homogenized with a three-roll kneader to make thick film dielectric paste. The paste is printed onto the bottom conductor on a ceramic substrate and dried, and dried film is sintered at 700°C in a five minutes to make thick film dielectric layer. The top conductor is formed to make a thick film capacitor
COPYRIGHT: (C)1979,JPO&Japio
JP11166677A 1977-09-19 1977-09-19 Paste for thick film dielectric layer Expired JPS6052529B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11166677A JPS6052529B2 (en) 1977-09-19 1977-09-19 Paste for thick film dielectric layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11166677A JPS6052529B2 (en) 1977-09-19 1977-09-19 Paste for thick film dielectric layer

Publications (2)

Publication Number Publication Date
JPS5445800A true JPS5445800A (en) 1979-04-11
JPS6052529B2 JPS6052529B2 (en) 1985-11-20

Family

ID=14567094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11166677A Expired JPS6052529B2 (en) 1977-09-19 1977-09-19 Paste for thick film dielectric layer

Country Status (1)

Country Link
JP (1) JPS6052529B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127307A (en) * 1982-12-29 1984-07-23 富士通株式会社 Insulator paste

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127307A (en) * 1982-12-29 1984-07-23 富士通株式会社 Insulator paste

Also Published As

Publication number Publication date
JPS6052529B2 (en) 1985-11-20

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