JPS5451475A - Wire bonding unit - Google Patents

Wire bonding unit

Info

Publication number
JPS5451475A
JPS5451475A JP11752177A JP11752177A JPS5451475A JP S5451475 A JPS5451475 A JP S5451475A JP 11752177 A JP11752177 A JP 11752177A JP 11752177 A JP11752177 A JP 11752177A JP S5451475 A JPS5451475 A JP S5451475A
Authority
JP
Japan
Prior art keywords
arm
capillary
cam
tip
carbon fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11752177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210020B2 (2
Inventor
Yoshihiro Endo
Nobushi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11752177A priority Critical patent/JPS5451475A/ja
Publication of JPS5451475A publication Critical patent/JPS5451475A/ja
Publication of JPS6210020B2 publication Critical patent/JPS6210020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP11752177A 1977-09-30 1977-09-30 Wire bonding unit Granted JPS5451475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11752177A JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11752177A JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Publications (2)

Publication Number Publication Date
JPS5451475A true JPS5451475A (en) 1979-04-23
JPS6210020B2 JPS6210020B2 (2) 1987-03-04

Family

ID=14713822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11752177A Granted JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Country Status (1)

Country Link
JP (1) JPS5451475A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263737A (ja) * 1987-04-22 1988-10-31 Toshiba Corp ワイヤボンデイング装置
JP2008218506A (ja) * 2007-02-28 2008-09-18 Shinkawa Ltd ホーン取付用アーム
GB2531965A (en) * 2014-02-26 2016-05-04 Doherty Roger A cracker device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263737A (ja) * 1987-04-22 1988-10-31 Toshiba Corp ワイヤボンデイング装置
JP2008218506A (ja) * 2007-02-28 2008-09-18 Shinkawa Ltd ホーン取付用アーム
GB2531965A (en) * 2014-02-26 2016-05-04 Doherty Roger A cracker device
GB2531965B (en) * 2014-02-26 2017-11-01 Doherty Roger A cracker device
GB2525720B (en) * 2014-02-26 2018-06-06 Doherty Roger A multipurpose device

Also Published As

Publication number Publication date
JPS6210020B2 (2) 1987-03-04

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