JPS6210020B2 - - Google Patents

Info

Publication number
JPS6210020B2
JPS6210020B2 JP52117521A JP11752177A JPS6210020B2 JP S6210020 B2 JPS6210020 B2 JP S6210020B2 JP 52117521 A JP52117521 A JP 52117521A JP 11752177 A JP11752177 A JP 11752177A JP S6210020 B2 JPS6210020 B2 JP S6210020B2
Authority
JP
Japan
Prior art keywords
arm
capillary
capillary arm
cam
swinging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52117521A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5451475A (en
Inventor
Yoshihiro Endo
Nobushi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP11752177A priority Critical patent/JPS5451475A/ja
Publication of JPS5451475A publication Critical patent/JPS5451475A/ja
Publication of JPS6210020B2 publication Critical patent/JPS6210020B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP11752177A 1977-09-30 1977-09-30 Wire bonding unit Granted JPS5451475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11752177A JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11752177A JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Publications (2)

Publication Number Publication Date
JPS5451475A JPS5451475A (en) 1979-04-23
JPS6210020B2 true JPS6210020B2 (2) 1987-03-04

Family

ID=14713822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11752177A Granted JPS5451475A (en) 1977-09-30 1977-09-30 Wire bonding unit

Country Status (1)

Country Link
JP (1) JPS5451475A (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263737A (ja) * 1987-04-22 1988-10-31 Toshiba Corp ワイヤボンデイング装置
JP4762934B2 (ja) * 2007-02-28 2011-08-31 株式会社新川 ホーン取付用アーム
WO2015128840A1 (en) * 2014-02-26 2015-09-03 Roger Doherty A multipurpose device

Also Published As

Publication number Publication date
JPS5451475A (en) 1979-04-23

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