JPS5455169A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5455169A
JPS5455169A JP12203177A JP12203177A JPS5455169A JP S5455169 A JPS5455169 A JP S5455169A JP 12203177 A JP12203177 A JP 12203177A JP 12203177 A JP12203177 A JP 12203177A JP S5455169 A JPS5455169 A JP S5455169A
Authority
JP
Japan
Prior art keywords
mounting part
leads
mounting
way
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12203177A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12203177A priority Critical patent/JPS5455169A/en
Publication of JPS5455169A publication Critical patent/JPS5455169A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent connection from becoming tilted by beforehand making the mounting part for mounting of a semiconductor element separately from lead frame, mounting the element thereon then connecting this to the leads of the frame at 3 or more points.
CONSTITUTION: The mounting part 2 to be formed to the end part of leads 3 provided to a lead frame 4 is made separately from the frame 4. Connection ends 7 are beforehand respectively projected from said mounting part 2 on the side opposing to the leads 3. A semiconductor element 1 is die-bonded to the mounting part 2 constituted in this way and the connection ends 7 of the mounting part 2 are secured by way of connection points 6 to the end parts of the leads 3 where the area is made wider. Since the mounting part 2 is made in separate construction in this way, thermal resistance decreases and yet inclination may be avoided at the time of cnnecting to the leads 3, thus the yield of production is improved
COPYRIGHT: (C)1979,JPO&Japio
JP12203177A 1977-10-12 1977-10-12 Semiconductor device Pending JPS5455169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12203177A JPS5455169A (en) 1977-10-12 1977-10-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12203177A JPS5455169A (en) 1977-10-12 1977-10-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5455169A true JPS5455169A (en) 1979-05-02

Family

ID=14825871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12203177A Pending JPS5455169A (en) 1977-10-12 1977-10-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5455169A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
US5150194A (en) * 1991-04-24 1992-09-22 Micron Technology, Inc. Anti-bow zip lead frame design
US5162895A (en) * 1990-04-18 1992-11-10 Kabushiki Kaisha Toshiba Lead frame for semiconductor device that prevents island torsion
US5696029A (en) * 1993-08-31 1997-12-09 Texas Instruments Incorporated Process for manufacturing a lead frame
US5763296A (en) * 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
US5162895A (en) * 1990-04-18 1992-11-10 Kabushiki Kaisha Toshiba Lead frame for semiconductor device that prevents island torsion
US5150194A (en) * 1991-04-24 1992-09-22 Micron Technology, Inc. Anti-bow zip lead frame design
US5763296A (en) * 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate
US5696029A (en) * 1993-08-31 1997-12-09 Texas Instruments Incorporated Process for manufacturing a lead frame

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