JPS51147255A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51147255A
JPS51147255A JP50070866A JP7086675A JPS51147255A JP S51147255 A JPS51147255 A JP S51147255A JP 50070866 A JP50070866 A JP 50070866A JP 7086675 A JP7086675 A JP 7086675A JP S51147255 A JPS51147255 A JP S51147255A
Authority
JP
Japan
Prior art keywords
semiconductor device
ccb
manufacturing process
corrosion resistance
solder connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50070866A
Other languages
Japanese (ja)
Inventor
Ryosaku Kanzawa
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50070866A priority Critical patent/JPS51147255A/en
Publication of JPS51147255A publication Critical patent/JPS51147255A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: In a semiconductor device employing the CCB (Controlled Collapse Bonding) method, to obtain with a minimum change in the manufacturing process, a device with improved corrosion resistance at the solder connection and higher stability in the surface of the semiconductor chip.
COPYRIGHT: (C)1976,JPO&Japio
JP50070866A 1975-06-13 1975-06-13 Semiconductor device Pending JPS51147255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50070866A JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50070866A JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51147255A true JPS51147255A (en) 1976-12-17

Family

ID=13443900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50070866A Pending JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51147255A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5920633U (en) * 1982-07-30 1984-02-08 富士通株式会社 Bump junction type semiconductor device
JPS5972780A (en) * 1982-10-19 1984-04-24 Nippon Denso Co Ltd Photoelectric conversion device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS5994441A (en) * 1982-11-19 1984-05-31 Nippon Denso Co Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5920633U (en) * 1982-07-30 1984-02-08 富士通株式会社 Bump junction type semiconductor device
JPS5972780A (en) * 1982-10-19 1984-04-24 Nippon Denso Co Ltd Photoelectric conversion device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS5994441A (en) * 1982-11-19 1984-05-31 Nippon Denso Co Ltd Semiconductor device

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