JPS5457958U - - Google Patents

Info

Publication number
JPS5457958U
JPS5457958U JP1977131037U JP13103777U JPS5457958U JP S5457958 U JPS5457958 U JP S5457958U JP 1977131037 U JP1977131037 U JP 1977131037U JP 13103777 U JP13103777 U JP 13103777U JP S5457958 U JPS5457958 U JP S5457958U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977131037U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977131037U priority Critical patent/JPS5457958U/ja
Publication of JPS5457958U publication Critical patent/JPS5457958U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/879Bump connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1977131037U 1977-09-29 1977-09-29 Pending JPS5457958U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977131037U JPS5457958U (ja) 1977-09-29 1977-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977131037U JPS5457958U (ja) 1977-09-29 1977-09-29

Publications (1)

Publication Number Publication Date
JPS5457958U true JPS5457958U (ja) 1979-04-21

Family

ID=29097228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977131037U Pending JPS5457958U (ja) 1977-09-29 1977-09-29

Country Status (1)

Country Link
JP (1) JPS5457958U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362537A (ja) * 1989-07-29 1991-03-18 Ibiden Co Ltd 電子部品塔載用基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148089A (ja) * 1974-05-20 1975-11-27
JPS5177078A (en) * 1974-12-27 1976-07-03 Suwa Seikosha Kk Handotaisochi

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148089A (ja) * 1974-05-20 1975-11-27
JPS5177078A (en) * 1974-12-27 1976-07-03 Suwa Seikosha Kk Handotaisochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362537A (ja) * 1989-07-29 1991-03-18 Ibiden Co Ltd 電子部品塔載用基板

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