JPS54579A - Resin seal semiconductor device - Google Patents

Resin seal semiconductor device

Info

Publication number
JPS54579A
JPS54579A JP6484177A JP6484177A JPS54579A JP S54579 A JPS54579 A JP S54579A JP 6484177 A JP6484177 A JP 6484177A JP 6484177 A JP6484177 A JP 6484177A JP S54579 A JPS54579 A JP S54579A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin seal
seal semiconductor
package
disperse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6484177A
Other languages
Japanese (ja)
Inventor
Eiji Oi
Tadayasu Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6484177A priority Critical patent/JPS54579A/en
Publication of JPS54579A publication Critical patent/JPS54579A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To disperse and absorb the thermal stress between sealing resin and package by connecting the empty electrodes of a standard package and dummy pads as well.
COPYRIGHT: (C)1979,JPO&Japio
JP6484177A 1977-06-03 1977-06-03 Resin seal semiconductor device Pending JPS54579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6484177A JPS54579A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6484177A JPS54579A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Publications (1)

Publication Number Publication Date
JPS54579A true JPS54579A (en) 1979-01-05

Family

ID=13269848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6484177A Pending JPS54579A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Country Status (1)

Country Link
JP (1) JPS54579A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703343A (en) * 1984-12-25 1987-10-27 Matsushita Electric Industrial Co., Ltd. Noise reduction feedback type comb filter
JPH01260845A (en) * 1988-02-22 1989-10-18 Motorola Inc Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703343A (en) * 1984-12-25 1987-10-27 Matsushita Electric Industrial Co., Ltd. Noise reduction feedback type comb filter
JPH01260845A (en) * 1988-02-22 1989-10-18 Motorola Inc Semiconductor device

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