JPS5433665A - Manufacture for resin sealed type semiconductor device and resin sealed metal mold - Google Patents

Manufacture for resin sealed type semiconductor device and resin sealed metal mold

Info

Publication number
JPS5433665A
JPS5433665A JP9960477A JP9960477A JPS5433665A JP S5433665 A JPS5433665 A JP S5433665A JP 9960477 A JP9960477 A JP 9960477A JP 9960477 A JP9960477 A JP 9960477A JP S5433665 A JPS5433665 A JP S5433665A
Authority
JP
Japan
Prior art keywords
resin sealed
metal mold
manufacture
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9960477A
Other languages
Japanese (ja)
Inventor
Atsushi Sasayama
Ryuichi Ikezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9960477A priority Critical patent/JPS5433665A/en
Publication of JPS5433665A publication Critical patent/JPS5433665A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To surely eliminate burr of resin and to increase the working efficiency, by providing the projection at the inner end in contact with the header retainer fixing semiconductors at upper metal mold and pouring resin with the projection closely contacted to the header at resin sealing.
COPYRIGHT: (C)1979,JPO&Japio
JP9960477A 1977-08-22 1977-08-22 Manufacture for resin sealed type semiconductor device and resin sealed metal mold Pending JPS5433665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9960477A JPS5433665A (en) 1977-08-22 1977-08-22 Manufacture for resin sealed type semiconductor device and resin sealed metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9960477A JPS5433665A (en) 1977-08-22 1977-08-22 Manufacture for resin sealed type semiconductor device and resin sealed metal mold

Publications (1)

Publication Number Publication Date
JPS5433665A true JPS5433665A (en) 1979-03-12

Family

ID=14251686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9960477A Pending JPS5433665A (en) 1977-08-22 1977-08-22 Manufacture for resin sealed type semiconductor device and resin sealed metal mold

Country Status (1)

Country Link
JP (1) JPS5433665A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175763U (en) * 1986-04-22 1987-11-07
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
US5151276A (en) * 1990-02-13 1992-09-29 Kabushiki Kaisha Toshiba Resin molding apparatus
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
JP2014192447A (en) * 2013-03-28 2014-10-06 Denso Corp Electronic control unit and manufacturing method of the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828955A (en) * 1971-08-20 1973-04-17
JPS501662A (en) * 1973-05-07 1975-01-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828955A (en) * 1971-08-20 1973-04-17
JPS501662A (en) * 1973-05-07 1975-01-09

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
JPS62175763U (en) * 1986-04-22 1987-11-07
US5151276A (en) * 1990-02-13 1992-09-29 Kabushiki Kaisha Toshiba Resin molding apparatus
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
US5776512A (en) * 1995-05-26 1998-07-07 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
JP2014192447A (en) * 2013-03-28 2014-10-06 Denso Corp Electronic control unit and manufacturing method of the same

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