JPS5459876A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5459876A
JPS5459876A JP12572177A JP12572177A JPS5459876A JP S5459876 A JPS5459876 A JP S5459876A JP 12572177 A JP12572177 A JP 12572177A JP 12572177 A JP12572177 A JP 12572177A JP S5459876 A JPS5459876 A JP S5459876A
Authority
JP
Japan
Prior art keywords
arm
bonding
spring
fulcrum
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12572177A
Other languages
Japanese (ja)
Other versions
JPS6027182B2 (en
Inventor
Osamu Sumiya
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52125721A priority Critical patent/JPS6027182B2/en
Publication of JPS5459876A publication Critical patent/JPS5459876A/en
Publication of JPS6027182B2 publication Critical patent/JPS6027182B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce inertia increase the speed of bonding by providing a verically moving auxiliary arm of a small size which supports a bonding wire to the vertically moving arm forming the bonding device.
CONSTITUTION: A slender arm 7 is horizntally disposed and its central part is oscillatably supported by a fulcrum 8. A driving cam 9 and a spring 10 connecting thereto are provided to the top of one end of the arm 7. A forked notch 12 is formed to the other end of the arm 7 and the v-pin 15 side of an auxilary arm 11 which has a capillary 14, a stopper pin 15 and a spring mounting stud 16 is inserted therein and is held oscillatable by a fulcrum 13. Furter,a extension spring 18 is mounted be tween the stud 16 and the spring mounting piece 17 on the arm 7. At the time of performing bonding with such constittion, the arm 7 is lowered and the bottom end of the capillary 14 at the end of the auxiliary arm 11 is contacted to the object to be bonded through the wire 19. Since the inertia of the auxiliary arm 11 is small, th action becomes of high speed
COPYRIGHT: (C)1979,JPO&Japio
JP52125721A 1977-10-21 1977-10-21 wire bonding equipment Expired JPS6027182B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52125721A JPS6027182B2 (en) 1977-10-21 1977-10-21 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52125721A JPS6027182B2 (en) 1977-10-21 1977-10-21 wire bonding equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61076501A Division JPS61234044A (en) 1986-04-04 1986-04-04 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS5459876A true JPS5459876A (en) 1979-05-14
JPS6027182B2 JPS6027182B2 (en) 1985-06-27

Family

ID=14917108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52125721A Expired JPS6027182B2 (en) 1977-10-21 1977-10-21 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS6027182B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding

Also Published As

Publication number Publication date
JPS6027182B2 (en) 1985-06-27

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