JPS5461473A - Etching tool - Google Patents

Etching tool

Info

Publication number
JPS5461473A
JPS5461473A JP12750877A JP12750877A JPS5461473A JP S5461473 A JPS5461473 A JP S5461473A JP 12750877 A JP12750877 A JP 12750877A JP 12750877 A JP12750877 A JP 12750877A JP S5461473 A JPS5461473 A JP S5461473A
Authority
JP
Japan
Prior art keywords
etching
wax
tool
wafer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12750877A
Other languages
Japanese (ja)
Inventor
Hiroshi Yokoyama
Akemi Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12750877A priority Critical patent/JPS5461473A/en
Publication of JPS5461473A publication Critical patent/JPS5461473A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To enable flat etching, by increasing the thickness of the circumference part of plate shape tool, and by constituting the upper edge so that it has equal or slightly higher surface than the upper surface of wafer to be bonded.
CONSTITUTION: In the etching vessel 1 filled in the etching solution 2, the wafer 7 and the tool 8 sticked with wax 8 are fixed, and gas is bubbled in th etching vessel 1 through the perforated plate 5 from the gas inlet provided under the etching vessel 1. since the circumference of the tool has a thickness for barrier and no bubbling 4 is directly collided with the wax 8, no wax distortion can be made
COPYRIGHT: (C)1979,JPO&Japio
JP12750877A 1977-10-26 1977-10-26 Etching tool Pending JPS5461473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12750877A JPS5461473A (en) 1977-10-26 1977-10-26 Etching tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12750877A JPS5461473A (en) 1977-10-26 1977-10-26 Etching tool

Publications (1)

Publication Number Publication Date
JPS5461473A true JPS5461473A (en) 1979-05-17

Family

ID=14961717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12750877A Pending JPS5461473A (en) 1977-10-26 1977-10-26 Etching tool

Country Status (1)

Country Link
JP (1) JPS5461473A (en)

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