JPS54861A - Scribing method for semiconductor wafer - Google Patents

Scribing method for semiconductor wafer

Info

Publication number
JPS54861A
JPS54861A JP6591277A JP6591277A JPS54861A JP S54861 A JPS54861 A JP S54861A JP 6591277 A JP6591277 A JP 6591277A JP 6591277 A JP6591277 A JP 6591277A JP S54861 A JPS54861 A JP S54861A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
scribing method
scribing
waveform
secure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6591277A
Other languages
Japanese (ja)
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP6591277A priority Critical patent/JPS54861A/en
Publication of JPS54861A publication Critical patent/JPS54861A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To secure a good scribing by giving irradiation of the laser pulse of more than twice onto the same street of the semiconductor substrate through variation of the waveform.
COPYRIGHT: (C)1979,JPO&Japio
JP6591277A 1977-06-03 1977-06-03 Scribing method for semiconductor wafer Pending JPS54861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6591277A JPS54861A (en) 1977-06-03 1977-06-03 Scribing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6591277A JPS54861A (en) 1977-06-03 1977-06-03 Scribing method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS54861A true JPS54861A (en) 1979-01-06

Family

ID=13300645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6591277A Pending JPS54861A (en) 1977-06-03 1977-06-03 Scribing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS54861A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037085A (en) * 2001-07-06 2003-02-07 Data Storage Inst Substrate cutting method and apparatus using laser irradiation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037085A (en) * 2001-07-06 2003-02-07 Data Storage Inst Substrate cutting method and apparatus using laser irradiation

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