JPS5494877A - Production of electronic part device - Google Patents

Production of electronic part device

Info

Publication number
JPS5494877A
JPS5494877A JP123778A JP123778A JPS5494877A JP S5494877 A JPS5494877 A JP S5494877A JP 123778 A JP123778 A JP 123778A JP 123778 A JP123778 A JP 123778A JP S5494877 A JPS5494877 A JP S5494877A
Authority
JP
Japan
Prior art keywords
sealing
electronic part
resin
specified position
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP123778A
Other languages
Japanese (ja)
Inventor
Toru Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP123778A priority Critical patent/JPS5494877A/en
Publication of JPS5494877A publication Critical patent/JPS5494877A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate difficulty of resin sealing quantity, sealing shape, etc. and achieve easier process by providing a resin sealing member having a supporting base layer on the exposed face side after sealing, disposing this in the specified position of an electronic part assembly, and heating this to melt thereby applying resin sealing.
CONSTITUTION: An electronic part is disposed to a wiring substrate 2 to form an electronic part assembly, and the resin sealing in the electronic part device for the specified position including the electrode lead-out parts of the electronic part is provided with the shape of covering the specified position. Here, a resin sealing part (a) having a supporting base layer 10a on the exposed face side after sealing is prepared and said sealing resin member is disposed in the specified position of the electronic part assembly, after which heating is applied to melt the sealing resin member 10, whereby resin sealing is applied to the specified position of the electronic part assembly. Thereby, the difficulty of sealing resin quantity, sealing shape, etc. may be eliminated and the process may be made easier.
COPYRIGHT: (C)1979,JPO&Japio
JP123778A 1978-01-11 1978-01-11 Production of electronic part device Pending JPS5494877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP123778A JPS5494877A (en) 1978-01-11 1978-01-11 Production of electronic part device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP123778A JPS5494877A (en) 1978-01-11 1978-01-11 Production of electronic part device

Publications (1)

Publication Number Publication Date
JPS5494877A true JPS5494877A (en) 1979-07-26

Family

ID=11495847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP123778A Pending JPS5494877A (en) 1978-01-11 1978-01-11 Production of electronic part device

Country Status (1)

Country Link
JP (1) JPS5494877A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123045A (en) * 1983-12-07 1985-07-01 Matsushita Electric Ind Co Ltd Package for electronic parts and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123045A (en) * 1983-12-07 1985-07-01 Matsushita Electric Ind Co Ltd Package for electronic parts and manufacture thereof

Similar Documents

Publication Publication Date Title
JPS5494877A (en) Production of electronic part device
BE875392A (en) THERMOINSULATING ELEMENT IN THE FORM OF A PLATE WITH AN INSULATING LAYER IN ALVEOLAR MATERIAL AND METHOD FOR MANUFACTURING THIS ELEMENT
JPS5258469A (en) Resin-molded type semiconductor device
JPS5632736A (en) Sealing method of hybrid integrated circuit device
JPS5337738A (en) Method and apparatus for curing of adhesive applied to board
JPS5432992A (en) Device and method for manufacturing semiconductor device
JPS52104060A (en) Resin mold type semiconductor device
JPS5735359A (en) Lead frame for semiconductor device
JPS5481073A (en) Sealing method for semiconductor element
EP0003155A3 (en) Method of manufacturing a device using a gold layer masking against a proton bombardment and device manufactured by means of the method
JPS5374367A (en) Semiconductor device
JPS51126068A (en) Manufacturing method of semi-conductor equipment
JPS5311931A (en) Method of laminating surface material in the production of corrugated board for interior
JPS5591841A (en) Manufacture of electronic device
JPS5268987A (en) Manufacturing method of heat-resistive and burning-resisitive power c ord
JPS533166A (en) Resin molding method
JPS51146583A (en) A process for preparing sandwich structure material
JPS5614101A (en) Pattern checking method
JPS5591837A (en) Manufacture of electronic device
JPS52156563A (en) Resin sealing method of semiconductor device
JPS53128483A (en) Fixing method of inlaying
JPS57187943A (en) Sealing method of semiconductor element
JPS51141086A (en) Decorative dish and method of producing the same
JPS5412684A (en) Manufacture of semiconductor device
JPS5399883A (en) Manufacture of semiconductor device