JPS5497380A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5497380A
JPS5497380A JP462578A JP462578A JPS5497380A JP S5497380 A JPS5497380 A JP S5497380A JP 462578 A JP462578 A JP 462578A JP 462578 A JP462578 A JP 462578A JP S5497380 A JPS5497380 A JP S5497380A
Authority
JP
Japan
Prior art keywords
film
oxidized
mask
substrate
redistributed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP462578A
Other languages
Japanese (ja)
Inventor
Shigero Kuninobu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP462578A priority Critical patent/JPS5497380A/en
Publication of JPS5497380A publication Critical patent/JPS5497380A/en
Pending legal-status Critical Current

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  • Bipolar Transistors (AREA)

Abstract

PURPOSE: To reduce the substrate bias effect of a MOS device and to improve shielding characteristics by a specific thermal processing method utilizing that B on the substrate surface lessens by being redistributed through thermal oxidation.
CONSTITUTION: On P-type Si 1 with B doped, oxidized film 3 is formed, one part 2 of film 3 is removed by nitriding-film mask 4, and the oxidized film is oxidized and removed by mask 4. At this time, 2(Dt)1/2 is made nearly equal to 1μm denoting diffusion coefficient of B and thermal oxidation time by D and (t) respectively. Lastly, the mask is removed. After this provess, the desired value to the B density can be obtained at surface la of the substrate and the density does not change under film 3 by nitriding-film 4. Next, B ions are injected via gate oxidized film 5 to control the threshold level, thereby forming n--type doped Si gate electrode 7. A window is made in film 5 and n+-type ion injected layer 8 is provided, so that even if annealing is done , B will not be redistributed. The surface is covered with SiO29 and electrode 10 is fitted. In this constitution, the need for a channel stopper is eliminated. Further, the punch-through dielectric strength becomes high and shielding characteristics improve.
COPYRIGHT: (C)1979,JPO&Japio
JP462578A 1978-01-18 1978-01-18 Manufacture of semiconductor device Pending JPS5497380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP462578A JPS5497380A (en) 1978-01-18 1978-01-18 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP462578A JPS5497380A (en) 1978-01-18 1978-01-18 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5497380A true JPS5497380A (en) 1979-08-01

Family

ID=11589215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP462578A Pending JPS5497380A (en) 1978-01-18 1978-01-18 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5497380A (en)

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