JPS5472668A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5472668A JPS5472668A JP13966177A JP13966177A JPS5472668A JP S5472668 A JPS5472668 A JP S5472668A JP 13966177 A JP13966177 A JP 13966177A JP 13966177 A JP13966177 A JP 13966177A JP S5472668 A JPS5472668 A JP S5472668A
- Authority
- JP
- Japan
- Prior art keywords
- film
- ion injection
- mask
- nitride film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To avoid the relocation of impurity into the surface insulation film, by performing ion injection annealing via the direct thermal nitride film formed on the Si surface.
CONSTITUTION: The insulation film 2 of the P type Si substrate 1 is opened, it is processed at 900 to 1300°C under NH3 atomosphere and Si3N4 3 is selectively coated. The B ion injection layer 5 is made on the thin film 3 by taking the film 2 as a mask. Next, processing is made at about 1000°C for about 30 minutes. In this case, the Si3N4 film 3 forms a strong mask against the diffusion of B and performs no absorbing out as SiO2, then the surface concentration of the layer 5 is not lowered. Further, the invasion of alkali ions can completely be blocked with the finness of the nitride film itself and good masking nature. Next, rquired gate film is formed by overlaying CVDSiO2 and the gate electrode material of polycrystal Si7 is laminated. After that, FET is formed with conventional methods. With this, correct threshold value can be assured with channel doping.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13966177A JPS5472668A (en) | 1977-11-21 | 1977-11-21 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13966177A JPS5472668A (en) | 1977-11-21 | 1977-11-21 | Manufacture for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5472668A true JPS5472668A (en) | 1979-06-11 |
| JPS6139751B2 JPS6139751B2 (en) | 1986-09-05 |
Family
ID=15250459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13966177A Granted JPS5472668A (en) | 1977-11-21 | 1977-11-21 | Manufacture for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5472668A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246325A (en) * | 1989-02-13 | 1990-10-02 | Internatl Business Mach Corp <Ibm> | Manufacture of transistor |
| KR100314715B1 (en) * | 1997-01-16 | 2002-02-19 | 가네꼬 히사시 | Semiconductor element with thermally nitrided film on high resistance film and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50148070A (en) * | 1974-05-20 | 1975-11-27 | ||
| JPS51148377A (en) * | 1975-06-14 | 1976-12-20 | Fujitsu Ltd | Manufacturing method of mis type semiconductor device |
| JPS5255375A (en) * | 1975-10-28 | 1977-05-06 | Ibm | Method of making semiconductor devices |
-
1977
- 1977-11-21 JP JP13966177A patent/JPS5472668A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50148070A (en) * | 1974-05-20 | 1975-11-27 | ||
| JPS51148377A (en) * | 1975-06-14 | 1976-12-20 | Fujitsu Ltd | Manufacturing method of mis type semiconductor device |
| JPS5255375A (en) * | 1975-10-28 | 1977-05-06 | Ibm | Method of making semiconductor devices |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246325A (en) * | 1989-02-13 | 1990-10-02 | Internatl Business Mach Corp <Ibm> | Manufacture of transistor |
| KR100314715B1 (en) * | 1997-01-16 | 2002-02-19 | 가네꼬 히사시 | Semiconductor element with thermally nitrided film on high resistance film and method of manufacturing the same |
| US6358808B1 (en) | 1997-01-16 | 2002-03-19 | Nec Corporation | Semiconductor element with thermally nitrided film on high resistance film and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6139751B2 (en) | 1986-09-05 |
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