JPS55118654A - Manufacture of high density circuit substrate - Google Patents

Manufacture of high density circuit substrate

Info

Publication number
JPS55118654A
JPS55118654A JP2649179A JP2649179A JPS55118654A JP S55118654 A JPS55118654 A JP S55118654A JP 2649179 A JP2649179 A JP 2649179A JP 2649179 A JP2649179 A JP 2649179A JP S55118654 A JPS55118654 A JP S55118654A
Authority
JP
Japan
Prior art keywords
hole
film
high density
sheet
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2649179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337518B2 (mo
Inventor
Nobuo Kamehara
Seiichi Yamada
Koichi Niwa
Kyohei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2649179A priority Critical patent/JPS55118654A/ja
Publication of JPS55118654A publication Critical patent/JPS55118654A/ja
Publication of JPS6337518B2 publication Critical patent/JPS6337518B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2649179A 1979-03-07 1979-03-07 Manufacture of high density circuit substrate Granted JPS55118654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2649179A JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2649179A JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Publications (2)

Publication Number Publication Date
JPS55118654A true JPS55118654A (en) 1980-09-11
JPS6337518B2 JPS6337518B2 (mo) 1988-07-26

Family

ID=12194961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2649179A Granted JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Country Status (1)

Country Link
JP (1) JPS55118654A (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0748261A4 (en) * 1992-03-30 1995-02-15 Vistatech Corp MULTILAYER CHIP STRUCTURE

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5064768A (mo) * 1973-10-12 1975-06-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5064768A (mo) * 1973-10-12 1975-06-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0748261A4 (en) * 1992-03-30 1995-02-15 Vistatech Corp MULTILAYER CHIP STRUCTURE

Also Published As

Publication number Publication date
JPS6337518B2 (mo) 1988-07-26

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