JPS5513963A - Photo semiconductor device - Google Patents

Photo semiconductor device

Info

Publication number
JPS5513963A
JPS5513963A JP8738078A JP8738078A JPS5513963A JP S5513963 A JPS5513963 A JP S5513963A JP 8738078 A JP8738078 A JP 8738078A JP 8738078 A JP8738078 A JP 8738078A JP S5513963 A JPS5513963 A JP S5513963A
Authority
JP
Japan
Prior art keywords
glass
stem
photo
small hole
here
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8738078A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Mizuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8738078A priority Critical patent/JPS5513963A/en
Publication of JPS5513963A publication Critical patent/JPS5513963A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

PURPOSE:To reduce coupling loss, by providing a light-transmitting component on a part of a container of a semiconductor device, directly mounting here a photo semiconductor chip, and thereby reducing the distance from the end surface of a photo fiber to be fitted here. CONSTITUTION:The midsection of stem 4, which forms can case, is made thin. Here is provided small hole 10, and an airtight glass window is formed on stem 4, including the small hole, by using cover glass 7, 50-100mum thick. Next, the outer edge of glass 7 is covered with thin metal film 8, and photo semiconductor chip 1 is directly mounted on the unexposed part of glass 7. These electrodes are connected to lead 11, for electric signaling and biasing, which passes through stem 4. After this, the tip of photo cable 2, which is protected by protective tube 2' inside small hole 10 of stem 4, is inserted from the back and is brought into contact with glass 7 on the lower surface of chip 1. Next, the entire case is covered by cap 3, and the interior is made airtight. By this, it is made possible to use very thin glass 7, and coupling loss is reduced almost the same as when there is no glass.
JP8738078A 1978-07-17 1978-07-17 Photo semiconductor device Pending JPS5513963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8738078A JPS5513963A (en) 1978-07-17 1978-07-17 Photo semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8738078A JPS5513963A (en) 1978-07-17 1978-07-17 Photo semiconductor device

Publications (1)

Publication Number Publication Date
JPS5513963A true JPS5513963A (en) 1980-01-31

Family

ID=13913281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8738078A Pending JPS5513963A (en) 1978-07-17 1978-07-17 Photo semiconductor device

Country Status (1)

Country Link
JP (1) JPS5513963A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636647A (en) * 1983-05-31 1987-01-13 Sumitomo Electric Industries, Ltd. Package for optical element
US4663652A (en) * 1983-11-21 1987-05-05 Sumotomo Electric Industries, Ltd. Package for optical device
JPH0279202U (en) * 1988-12-01 1990-06-19
JPH02242707A (en) * 1989-03-10 1990-09-27 Suzuyo Kogyo Kk Machine for packing food together with sauce
US5069258A (en) * 1988-07-01 1991-12-03 Deutsche Automobilgesellschaft Mbh Device for the vibration filling of porous plaques for voltaic cells
JPH0572703U (en) * 1992-03-06 1993-10-05 四国化工機株式会社 Container sealing device
EP0697743A1 (en) * 1994-08-17 1996-02-21 Seiko Instruments Inc. Avalanche photodiode joined with with an integrated circuit package and method of fabrication
US5814871A (en) * 1996-08-15 1998-09-29 Fujitsu Ltd. Optical semiconductor assembly having a conductive float pad
JP2016091011A (en) * 2014-11-05 2016-05-23 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ Low-cost, connectorless and ruggedized small-form-factor optical sub-assembly (osa), and data bus-in-a-box (bib)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636647A (en) * 1983-05-31 1987-01-13 Sumitomo Electric Industries, Ltd. Package for optical element
US4663652A (en) * 1983-11-21 1987-05-05 Sumotomo Electric Industries, Ltd. Package for optical device
US5069258A (en) * 1988-07-01 1991-12-03 Deutsche Automobilgesellschaft Mbh Device for the vibration filling of porous plaques for voltaic cells
JPH0279202U (en) * 1988-12-01 1990-06-19
JPH02242707A (en) * 1989-03-10 1990-09-27 Suzuyo Kogyo Kk Machine for packing food together with sauce
JPH0572703U (en) * 1992-03-06 1993-10-05 四国化工機株式会社 Container sealing device
EP0697743A1 (en) * 1994-08-17 1996-02-21 Seiko Instruments Inc. Avalanche photodiode joined with with an integrated circuit package and method of fabrication
US5814871A (en) * 1996-08-15 1998-09-29 Fujitsu Ltd. Optical semiconductor assembly having a conductive float pad
JP2016091011A (en) * 2014-11-05 2016-05-23 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ Low-cost, connectorless and ruggedized small-form-factor optical sub-assembly (osa), and data bus-in-a-box (bib)

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