JPS5624960A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5624960A
JPS5624960A JP10090179A JP10090179A JPS5624960A JP S5624960 A JPS5624960 A JP S5624960A JP 10090179 A JP10090179 A JP 10090179A JP 10090179 A JP10090179 A JP 10090179A JP S5624960 A JPS5624960 A JP S5624960A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
wire
difference
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10090179A
Other languages
Japanese (ja)
Inventor
Hiroshi Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10090179A priority Critical patent/JPS5624960A/en
Publication of JPS5624960A publication Critical patent/JPS5624960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent contact of a coupling wire with the end of a semiconductor element by forming a stepwise difference at the end of an inner lead wire. CONSTITUTION:The stepwise difference 3 is formed so that the end 1 of an inner lead wire is higher than the fixing portion 2 of a semiconductor element. Thus, a fine wire may not make contact with the end of the element. Further, this difference serves as a stopper for removal after sealing the element with resin.
JP10090179A 1979-08-07 1979-08-07 Lead frame for semiconductor device Pending JPS5624960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10090179A JPS5624960A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10090179A JPS5624960A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5624960A true JPS5624960A (en) 1981-03-10

Family

ID=14286239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10090179A Pending JPS5624960A (en) 1979-08-07 1979-08-07 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5624960A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173750A (en) * 1986-01-28 1987-07-30 Fujitsu Ltd Semiconductor device
JP2010528830A (en) * 2007-06-11 2010-08-26 メッツォ ペーパー インコーポレイテッド Cyclone separator and method for separating material from a gas stream

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173750A (en) * 1986-01-28 1987-07-30 Fujitsu Ltd Semiconductor device
JP2010528830A (en) * 2007-06-11 2010-08-26 メッツォ ペーパー インコーポレイテッド Cyclone separator and method for separating material from a gas stream
JP4922451B2 (en) * 2007-06-11 2012-04-25 メッツォ ペーパー インコーポレイテッド Cyclone separator and method for separating material from a gas stream

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