JPS55145159A - Manufacture of copper foil with superior flexibility for printed wiring plate - Google Patents

Manufacture of copper foil with superior flexibility for printed wiring plate

Info

Publication number: JPS55145159A
Authority: JP; Japan
Prior art keywords: foil; manufacture; copper foil; printed wiring; wiring plate
Prior art date: 1979-04-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP4451979A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5735267B2 (2

Inventor

Yasuo Yamane

Shigeo Shinozaki

Taku Kuroyanagi

Kiichi Akasaka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

FURUKAWA KINZOKU KOGYO KK

Furukawa Metals Co Ltd

Original Assignee

FURUKAWA KINZOKU KOGYO KK

Furukawa Metals Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-04-12

Filing date

1979-04-12

Publication date

1980-11-12

1979-04-12 Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK

1979-04-12 Priority to JP4451979A priority Critical patent/JPS55145159A/ja

1980-11-12 Publication of JPS55145159A publication Critical patent/JPS55145159A/ja

1982-07-28 Publication of JPS5735267B2 publication Critical patent/JPS5735267B2/ja

Status Granted legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
238000004519 manufacturing process Methods 0.000 title abstract 3
239000011889 copper foil Substances 0.000 title 1
238000010438 heat treatment Methods 0.000 abstract 3
239000000853 adhesive Substances 0.000 abstract 2
230000001070 adhesive effect Effects 0.000 abstract 2
239000011248 coating agent Substances 0.000 abstract 2
238000000576 coating method Methods 0.000 abstract 2
238000005097 cold rolling Methods 0.000 abstract 2
238000001035 drying Methods 0.000 abstract 1
238000001704 evaporation Methods 0.000 abstract 1
230000008020 evaporation Effects 0.000 abstract 1
239000011888 foil Substances 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
238000005096 rolling process Methods 0.000 abstract 1
239000002904 solvent Substances 0.000 abstract 1

Landscapes

Metal Rolling (AREA)
Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Manufacturing Of Printed Wiring (AREA)

JP4451979A 1979-04-12 1979-04-12 Manufacture of copper foil with superior flexibility for printed wiring plate Granted JPS55145159A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP4451979A JPS55145159A (en)	1979-04-12	1979-04-12	Manufacture of copper foil with superior flexibility for printed wiring plate

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4451979A JPS55145159A (en)	1979-04-12	1979-04-12	Manufacture of copper foil with superior flexibility for printed wiring plate

Publications (2)

Publication Number	Publication Date
JPS55145159A true JPS55145159A (en)	1980-11-12
JPS5735267B2 JPS5735267B2 (2)	1982-07-28

Family

ID=12693779

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4451979A Granted JPS55145159A (en)	1979-04-12	1979-04-12	Manufacture of copper foil with superior flexibility for printed wiring plate

Country Status (1)

Country	Link
JP (1)	JPS55145159A (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5954298A (ja) *	1982-09-21	1984-03-29	日立化成工業株式会社	印刷配線用銅張り積層板の製造法
JPS5978592A (ja) *	1982-10-27	1984-05-07	株式会社フジクラ	フレキシブルプリント板
JPS6015002A (ja) *	1983-07-07	1985-01-25	Hitachi Cable Ltd	圧延銅箔
JPS63112003A (ja) *	1986-10-30	1988-05-17	Furukawa Electric Co Ltd:The	半導体用銅系リ−ド材の製造法
JPH02263959A (ja) *	1989-04-04	1990-10-26	Hitachi Cable Ltd	無酸素銅圧延箔およびそれを用いたフレキシブルプリント基板
KR20200066263A (ko)	2017-10-12	2020-06-09	후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤	경질 압연 동박 및 그 경질 압연 동박의 제조 방법

1979
- 1979-04-12 JP JP4451979A patent/JPS55145159A/ja active Granted

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5954298A (ja) *	1982-09-21	1984-03-29	日立化成工業株式会社	印刷配線用銅張り積層板の製造法
JPS5978592A (ja) *	1982-10-27	1984-05-07	株式会社フジクラ	フレキシブルプリント板
JPS6015002A (ja) *	1983-07-07	1985-01-25	Hitachi Cable Ltd	圧延銅箔
JPS63112003A (ja) *	1986-10-30	1988-05-17	Furukawa Electric Co Ltd:The	半導体用銅系リ−ド材の製造法
JPH02263959A (ja) *	1989-04-04	1990-10-26	Hitachi Cable Ltd	無酸素銅圧延箔およびそれを用いたフレキシブルプリント基板
KR20200066263A (ko)	2017-10-12	2020-06-09	후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤	경질 압연 동박 및 그 경질 압연 동박의 제조 방법
US10882088B2 (en)	2017-10-12	2021-01-05	Fukuda Metal Foil & Powder Co., Ltd.	Hard rolled-copper foil and method of manufacturing the hard rolled-copper foil

Also Published As

Publication number	Publication date
JPS5735267B2 (2)	1982-07-28

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