JPS5735267B2 - - Google Patents
Info
- Publication number
- JPS5735267B2 JPS5735267B2 JP4451979A JP4451979A JPS5735267B2 JP S5735267 B2 JPS5735267 B2 JP S5735267B2 JP 4451979 A JP4451979 A JP 4451979A JP 4451979 A JP4451979 A JP 4451979A JP S5735267 B2 JPS5735267 B2 JP S5735267B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Metal Rolling (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4451979A JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4451979A JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55145159A JPS55145159A (en) | 1980-11-12 |
| JPS5735267B2 true JPS5735267B2 (2) | 1982-07-28 |
Family
ID=12693779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4451979A Granted JPS55145159A (en) | 1979-04-12 | 1979-04-12 | Manufacture of copper foil with superior flexibility for printed wiring plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55145159A (2) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954298A (ja) * | 1982-09-21 | 1984-03-29 | 日立化成工業株式会社 | 印刷配線用銅張り積層板の製造法 |
| JPS5978592A (ja) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | フレキシブルプリント板 |
| JPS6015002A (ja) * | 1983-07-07 | 1985-01-25 | Hitachi Cable Ltd | 圧延銅箔 |
| JPS63112003A (ja) * | 1986-10-30 | 1988-05-17 | Furukawa Electric Co Ltd:The | 半導体用銅系リ−ド材の製造法 |
| JPH02263959A (ja) * | 1989-04-04 | 1990-10-26 | Hitachi Cable Ltd | 無酸素銅圧延箔およびそれを用いたフレキシブルプリント基板 |
| JP6442020B1 (ja) | 2017-10-12 | 2018-12-19 | 福田金属箔粉工業株式会社 | 硬質圧延銅箔及び該硬質圧延銅箔の製造方法 |
-
1979
- 1979-04-12 JP JP4451979A patent/JPS55145159A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55145159A (en) | 1980-11-12 |