JPS55145366A - Ohmic electrode of n-type semiconductor of groups 3-5 metals in periodic table and forming method of the same - Google Patents
Ohmic electrode of n-type semiconductor of groups 3-5 metals in periodic table and forming method of the sameInfo
- Publication number
- JPS55145366A JPS55145366A JP5390679A JP5390679A JPS55145366A JP S55145366 A JPS55145366 A JP S55145366A JP 5390679 A JP5390679 A JP 5390679A JP 5390679 A JP5390679 A JP 5390679A JP S55145366 A JPS55145366 A JP S55145366A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ohmic electrode
- metals
- groups
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To improve the yield and the reliability of an ohmic electrode and to reduce the cost thereof by forming the electrode of germanium, nickel and aluminum to rigidly and easily bonding it via wire. CONSTITUTION:A wafer made of n-type GaAs substrate 1 or the like is heated at 100-450 deg.C in vacuum, and Ge is vacuum evaporated through a mask on the surface of the substrate 1 thus heated to form a Ge layer thereon. Then, Ni is similarly vacuum evaporated on the Ge layer to form an Ni layer thereon, and aluminum is similarly vacuum evaporated on the Ni layer to form an aluminum layer thereon. Thereafter, the wafer formed with the Ge, Ni and Al layers is heated at 450- 550 deg.C in inert or reducing atmosphere or in vacuum. Thus, ohmic electrodes 5 made of a number of Ge, Ni and Al are selectively formed on the substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54053906A JPS5950213B2 (en) | 1979-04-27 | 1979-04-27 | N-type gallium arsenide ohmic electrode and its formation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54053906A JPS5950213B2 (en) | 1979-04-27 | 1979-04-27 | N-type gallium arsenide ohmic electrode and its formation method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62205511A Division JPS63126272A (en) | 1987-08-18 | 1987-08-18 | Formation of ohmic electrode of n-type gallium arsenide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55145366A true JPS55145366A (en) | 1980-11-12 |
| JPS5950213B2 JPS5950213B2 (en) | 1984-12-07 |
Family
ID=12955751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54053906A Expired JPS5950213B2 (en) | 1979-04-27 | 1979-04-27 | N-type gallium arsenide ohmic electrode and its formation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950213B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57114229A (en) * | 1981-01-07 | 1982-07-16 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of ohmic electrode |
| JPS63126272A (en) * | 1987-08-18 | 1988-05-30 | Mitsubishi Electric Corp | Formation of ohmic electrode of n-type gallium arsenide |
| WO1989004057A1 (en) * | 1987-10-20 | 1989-05-05 | Bell Communications Research, Inc. | Epitaxial intermetallic contact for compound semiconductors |
| US10996285B2 (en) | 2013-11-19 | 2021-05-04 | Hyun Chang Lee | Method of detecting earth leaking point without interrupting a power supply |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5063877A (en) * | 1973-09-26 | 1975-05-30 | ||
| JPS54134558A (en) * | 1978-04-10 | 1979-10-19 | Nec Corp | Semiconductor device |
-
1979
- 1979-04-27 JP JP54053906A patent/JPS5950213B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5063877A (en) * | 1973-09-26 | 1975-05-30 | ||
| JPS54134558A (en) * | 1978-04-10 | 1979-10-19 | Nec Corp | Semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57114229A (en) * | 1981-01-07 | 1982-07-16 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of ohmic electrode |
| JPS63126272A (en) * | 1987-08-18 | 1988-05-30 | Mitsubishi Electric Corp | Formation of ohmic electrode of n-type gallium arsenide |
| WO1989004057A1 (en) * | 1987-10-20 | 1989-05-05 | Bell Communications Research, Inc. | Epitaxial intermetallic contact for compound semiconductors |
| US10996285B2 (en) | 2013-11-19 | 2021-05-04 | Hyun Chang Lee | Method of detecting earth leaking point without interrupting a power supply |
| USRE50683E1 (en) | 2013-11-19 | 2025-12-02 | Hyun Chang Lee | Method of detecting earth leaking point without interrupting a power supply |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5950213B2 (en) | 1984-12-07 |
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