JPS55150233A - Apparatus for treating semiconductor wafer - Google Patents

Apparatus for treating semiconductor wafer

Info

Publication number
JPS55150233A
JPS55150233A JP4463480A JP4463480A JPS55150233A JP S55150233 A JPS55150233 A JP S55150233A JP 4463480 A JP4463480 A JP 4463480A JP 4463480 A JP4463480 A JP 4463480A JP S55150233 A JPS55150233 A JP S55150233A
Authority
JP
Japan
Prior art keywords
etching solution
flowing paths
solution
box
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4463480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5734651B2 (2
Inventor
Tamotsu Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4463480A priority Critical patent/JPS55150233A/ja
Publication of JPS55150233A publication Critical patent/JPS55150233A/ja
Publication of JPS5734651B2 publication Critical patent/JPS5734651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP4463480A 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer Granted JPS55150233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4463480A JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4463480A JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3962572A Division JPS5546054B2 (2) 1972-04-21 1972-04-21

Publications (2)

Publication Number Publication Date
JPS55150233A true JPS55150233A (en) 1980-11-22
JPS5734651B2 JPS5734651B2 (2) 1982-07-24

Family

ID=12696852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4463480A Granted JPS55150233A (en) 1980-04-07 1980-04-07 Apparatus for treating semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55150233A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007058876A1 (de) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268349U (2) * 1985-10-17 1987-04-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007058876A1 (de) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen

Also Published As

Publication number Publication date
JPS5734651B2 (2) 1982-07-24

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