JPS55157471A - Dish for bonding workpieces - Google Patents

Dish for bonding workpieces

Info

Publication number
JPS55157471A
JPS55157471A JP6102779A JP6102779A JPS55157471A JP S55157471 A JPS55157471 A JP S55157471A JP 6102779 A JP6102779 A JP 6102779A JP 6102779 A JP6102779 A JP 6102779A JP S55157471 A JPS55157471 A JP S55157471A
Authority
JP
Japan
Prior art keywords
bonding
dish
bonding surface
thermal
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6102779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5742472B2 (cs
Inventor
Atsushi Une
Yoshiyuki Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6102779A priority Critical patent/JPS55157471A/ja
Publication of JPS55157471A publication Critical patent/JPS55157471A/ja
Publication of JPS5742472B2 publication Critical patent/JPS5742472B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP6102779A 1979-05-19 1979-05-19 Dish for bonding workpieces Granted JPS55157471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6102779A JPS55157471A (en) 1979-05-19 1979-05-19 Dish for bonding workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6102779A JPS55157471A (en) 1979-05-19 1979-05-19 Dish for bonding workpieces

Publications (2)

Publication Number Publication Date
JPS55157471A true JPS55157471A (en) 1980-12-08
JPS5742472B2 JPS5742472B2 (cs) 1982-09-08

Family

ID=13159403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6102779A Granted JPS55157471A (en) 1979-05-19 1979-05-19 Dish for bonding workpieces

Country Status (1)

Country Link
JP (1) JPS55157471A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755011B1 (ko) * 2005-12-14 2007-09-06 주식회사 실트론 연마용 정반, 이를 사용한 연마장치 및 연마방법
CN110744440A (zh) * 2019-10-22 2020-02-04 西安奕斯伟硅片技术有限公司 一种双面研磨装置及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190780U (ja) * 1982-06-11 1983-12-19 富士電機株式会社 ゲ−ム付自動販売機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111993A (en) * 1975-03-27 1976-10-02 Supiide Fuamu Kk Apparatus for fabricating thin work as semiconductor or the like

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111993A (en) * 1975-03-27 1976-10-02 Supiide Fuamu Kk Apparatus for fabricating thin work as semiconductor or the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755011B1 (ko) * 2005-12-14 2007-09-06 주식회사 실트론 연마용 정반, 이를 사용한 연마장치 및 연마방법
CN110744440A (zh) * 2019-10-22 2020-02-04 西安奕斯伟硅片技术有限公司 一种双面研磨装置及方法

Also Published As

Publication number Publication date
JPS5742472B2 (cs) 1982-09-08

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