JPS55158698A - Method of fabricating multilayer wiring substrate - Google Patents

Method of fabricating multilayer wiring substrate

Info

Publication number
JPS55158698A
JPS55158698A JP6729179A JP6729179A JPS55158698A JP S55158698 A JPS55158698 A JP S55158698A JP 6729179 A JP6729179 A JP 6729179A JP 6729179 A JP6729179 A JP 6729179A JP S55158698 A JPS55158698 A JP S55158698A
Authority
JP
Japan
Prior art keywords
wiring substrate
multilayer wiring
fabricating multilayer
fabricating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6729179A
Other languages
Japanese (ja)
Inventor
Hikari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6729179A priority Critical patent/JPS55158698A/en
Publication of JPS55158698A publication Critical patent/JPS55158698A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP6729179A 1979-05-30 1979-05-30 Method of fabricating multilayer wiring substrate Pending JPS55158698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6729179A JPS55158698A (en) 1979-05-30 1979-05-30 Method of fabricating multilayer wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6729179A JPS55158698A (en) 1979-05-30 1979-05-30 Method of fabricating multilayer wiring substrate

Publications (1)

Publication Number Publication Date
JPS55158698A true JPS55158698A (en) 1980-12-10

Family

ID=13340722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6729179A Pending JPS55158698A (en) 1979-05-30 1979-05-30 Method of fabricating multilayer wiring substrate

Country Status (1)

Country Link
JP (1) JPS55158698A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187999A (en) * 1981-05-14 1982-11-18 Nippon Electric Co Multilayer circuit board with improved wiring

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114069A (en) * 1977-03-15 1978-10-05 Fujitsu Ltd Method of producing multilayer circuit board
JPS53141465A (en) * 1977-05-16 1978-12-09 Hitachi Ltd Method of producing ceramic thick multilayer circuit board
JPS53145057A (en) * 1977-05-24 1978-12-16 Fujitsu Ltd Method of producing multilayer ceramic board
JPS5463268A (en) * 1977-10-29 1979-05-22 Hai Meeru Kk Thin type multilayer printed circuit material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114069A (en) * 1977-03-15 1978-10-05 Fujitsu Ltd Method of producing multilayer circuit board
JPS53141465A (en) * 1977-05-16 1978-12-09 Hitachi Ltd Method of producing ceramic thick multilayer circuit board
JPS53145057A (en) * 1977-05-24 1978-12-16 Fujitsu Ltd Method of producing multilayer ceramic board
JPS5463268A (en) * 1977-10-29 1979-05-22 Hai Meeru Kk Thin type multilayer printed circuit material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187999A (en) * 1981-05-14 1982-11-18 Nippon Electric Co Multilayer circuit board with improved wiring

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