JPS5516012A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5516012A JPS5516012A JP8792878A JP8792878A JPS5516012A JP S5516012 A JPS5516012 A JP S5516012A JP 8792878 A JP8792878 A JP 8792878A JP 8792878 A JP8792878 A JP 8792878A JP S5516012 A JPS5516012 A JP S5516012A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin composition
- organic peroxide
- unsaturated polyester
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000002253 acid Substances 0.000 abstract 3
- 150000001451 organic peroxides Chemical class 0.000 abstract 3
- 229920006305 unsaturated polyester Polymers 0.000 abstract 3
- 150000007513 acids Chemical class 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 2
Landscapes
- Polyesters Or Polycarbonates (AREA)
Abstract
PURPOSE: Title thermosetting resin composition that is composed of an unsaturated polyester modified with diendomethylenetetrahydrophthalic acid and an organic peroxide in a specific proportion, thus having high storage stability and good characteristics as a thermosetting resin.
CONSTITUTION: Said thermosetting resin composition comprises 85W99 parts by wt of an unsaturated polyester modified with 3,6-endomethylenetetrahydrophthalic acid and 15W1 parts of an organic peroxide, thus having high storage stability and giving cured resin products with heightened heat distortion temperature. The acids used in the unsaturated polyester consists of unsaturated and saturated ones at a molar ratio of 1.00/9.00W9.00/1.00 and the content of 3,6-endomethylenetetrahydrophthalic acid in the saturated acids is preferably 30W70%. The organic peroxide used decomposes preferably at 100W200°C and the suitable curing temperature ranges from 100 to 230°C.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792878A JPS5516012A (en) | 1978-07-19 | 1978-07-19 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792878A JPS5516012A (en) | 1978-07-19 | 1978-07-19 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5516012A true JPS5516012A (en) | 1980-02-04 |
| JPS6226329B2 JPS6226329B2 (en) | 1987-06-08 |
Family
ID=13928569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8792878A Granted JPS5516012A (en) | 1978-07-19 | 1978-07-19 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5516012A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04104971U (en) * | 1991-02-25 | 1992-09-09 | シンコハンガー株式会社 | Hanger |
-
1978
- 1978-07-19 JP JP8792878A patent/JPS5516012A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04104971U (en) * | 1991-02-25 | 1992-09-09 | シンコハンガー株式会社 | Hanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226329B2 (en) | 1987-06-08 |
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