JPS55162247A - Composite ic device - Google Patents

Composite ic device

Info

Publication number
JPS55162247A
JPS55162247A JP6972879A JP6972879A JPS55162247A JP S55162247 A JPS55162247 A JP S55162247A JP 6972879 A JP6972879 A JP 6972879A JP 6972879 A JP6972879 A JP 6972879A JP S55162247 A JPS55162247 A JP S55162247A
Authority
JP
Japan
Prior art keywords
case
grommet
resin
gap
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6972879A
Other languages
Japanese (ja)
Inventor
Toshio Hiroe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6972879A priority Critical patent/JPS55162247A/en
Publication of JPS55162247A publication Critical patent/JPS55162247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve humidity resistance by the method wherein a grommet for pulling out an external lead is fitted on a part of a case, and resin sealing is operated, and at this time a part of the joining surface of the case and grommet is cut and a gap is provided, and this gas is also filled with resin. CONSTITUTION:Electronic component 2 of composite IC structure is mounted on ceramic substrate 1, lead terminal 3 is soldered, and the entire body is covered with silicone resin. Next, the back of substrate 1 is fixed inside aluminum case 5', whose upper end is open. Grommet 7' having takeout lead 6 is inserted into the opening provided on one wall of case 5'. Its end is connected to lead terminal 3. In this structure, the joining surface of grommet 7' and case 5' is cut, and thereby step 10' is provided on grommet 7' and step 10 on case 5' so as to form gap 9. This gap is also filled with resin 8. By this, the sealed distance becomes long and humidity resistance is increased.
JP6972879A 1979-06-04 1979-06-04 Composite ic device Pending JPS55162247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6972879A JPS55162247A (en) 1979-06-04 1979-06-04 Composite ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6972879A JPS55162247A (en) 1979-06-04 1979-06-04 Composite ic device

Publications (1)

Publication Number Publication Date
JPS55162247A true JPS55162247A (en) 1980-12-17

Family

ID=13411177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6972879A Pending JPS55162247A (en) 1979-06-04 1979-06-04 Composite ic device

Country Status (1)

Country Link
JP (1) JPS55162247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242481U (en) * 1988-09-16 1990-03-23
JP2022174646A (en) * 2021-05-11 2022-11-24 株式会社タムラ製作所 Electronics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242481U (en) * 1988-09-16 1990-03-23
JP2022174646A (en) * 2021-05-11 2022-11-24 株式会社タムラ製作所 Electronics

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