JPS5521119A - Wafer continuously processing apparatus - Google Patents

Wafer continuously processing apparatus

Info

Publication number
JPS5521119A
JPS5521119A JP9359278A JP9359278A JPS5521119A JP S5521119 A JPS5521119 A JP S5521119A JP 9359278 A JP9359278 A JP 9359278A JP 9359278 A JP9359278 A JP 9359278A JP S5521119 A JPS5521119 A JP S5521119A
Authority
JP
Japan
Prior art keywords
wafer
washing
etch
washing tank
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9359278A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Hisao Seki
Shiro Terasaki
Hitoshi Horimuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9359278A priority Critical patent/JPS5521119A/en
Priority to US06/061,049 priority patent/US4282825A/en
Priority to DE19792931308 priority patent/DE2931308A1/en
Publication of JPS5521119A publication Critical patent/JPS5521119A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To perform effectively an etch-washing so that liquid would come into full contact with the back and surface by washing a wafer in an annular etch-washing tank while carrying its circumferential portion firmly.
CONSTITUTION: A wafer 12 to 15 are arranged to be positioned in a predetermined distance along an annular bottom face of an etch-washing tank by utilizing a wafer sustaining plate 4 constituted by putting one of two sector plates 4a and 4b on another to be awshed preferably. According to such a construction, the wafer can be carried only in the circumferential portion of the washing tank to efficiently achieve the etch-washing by permitting the liquid to come into full contact with the back and front face of the wafer.
COPYRIGHT: (C)1980,JPO&Japio
JP9359278A 1978-08-02 1978-08-02 Wafer continuously processing apparatus Pending JPS5521119A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9359278A JPS5521119A (en) 1978-08-02 1978-08-02 Wafer continuously processing apparatus
US06/061,049 US4282825A (en) 1978-08-02 1979-07-26 Surface treatment device
DE19792931308 DE2931308A1 (en) 1978-08-02 1979-08-01 SURFACE TREATMENT DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9359278A JPS5521119A (en) 1978-08-02 1978-08-02 Wafer continuously processing apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14416978A Division JPS5521193A (en) 1978-08-02 1978-11-24 Wafer processing device

Publications (1)

Publication Number Publication Date
JPS5521119A true JPS5521119A (en) 1980-02-15

Family

ID=14086562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9359278A Pending JPS5521119A (en) 1978-08-02 1978-08-02 Wafer continuously processing apparatus

Country Status (1)

Country Link
JP (1) JPS5521119A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (en) * 1974-05-10 1975-11-21
JPS5110944A (en) * 1974-07-17 1976-01-28 Shinshu Seiki Kk HATSUNET SUHETSUDO

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (en) * 1974-05-10 1975-11-21
JPS5110944A (en) * 1974-07-17 1976-01-28 Shinshu Seiki Kk HATSUNET SUHETSUDO

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