JPS5521193A - Wafer processing device - Google Patents

Wafer processing device

Info

Publication number
JPS5521193A
JPS5521193A JP14416978A JP14416978A JPS5521193A JP S5521193 A JPS5521193 A JP S5521193A JP 14416978 A JP14416978 A JP 14416978A JP 14416978 A JP14416978 A JP 14416978A JP S5521193 A JPS5521193 A JP S5521193A
Authority
JP
Japan
Prior art keywords
wafer
plates
sides
processing device
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14416978A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Hisao Seki
Shiro Terasaki
Hitoshi Horimuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14416978A priority Critical patent/JPS5521193A/en
Priority to US06/061,049 priority patent/US4282825A/en
Priority to DE19792931308 priority patent/DE2931308A1/en
Publication of JPS5521193A publication Critical patent/JPS5521193A/en
Pending legal-status Critical Current

Links

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  • Weting (AREA)

Abstract

PURPOSE: To equally treat the both sides of a wafer with a wafer holder mechanism and a stirrer placed close to the both sides of said wafer to transfer through sliding relatively to wafer surface.
CONSTITUTION: A wafer holder plate 4 consists of two sector plates 4a and 4b placed one upon the other. A wafer W is fitted between the adjacent two sets of said plates 4 and 4 from sideward, and mutually-facing edge portions of said wafer W are sandwiched between the upper and lower plates of said sector plates 4 and 4 on the both sides. A liquid stirring plate 12 holds said holder plate 4 with upper and lower plates and transfers through sliding relatively to wafer surface W.
COPYRIGHT: (C)1980,JPO&Japio
JP14416978A 1978-08-02 1978-11-24 Wafer processing device Pending JPS5521193A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP14416978A JPS5521193A (en) 1978-11-24 1978-11-24 Wafer processing device
US06/061,049 US4282825A (en) 1978-08-02 1979-07-26 Surface treatment device
DE19792931308 DE2931308A1 (en) 1978-08-02 1979-08-01 SURFACE TREATMENT DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14416978A JPS5521193A (en) 1978-11-24 1978-11-24 Wafer processing device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9359278A Division JPS5521119A (en) 1978-08-02 1978-08-02 Wafer continuously processing apparatus

Publications (1)

Publication Number Publication Date
JPS5521193A true JPS5521193A (en) 1980-02-15

Family

ID=15355796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14416978A Pending JPS5521193A (en) 1978-08-02 1978-11-24 Wafer processing device

Country Status (1)

Country Link
JP (1) JPS5521193A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857584A (en) * 1971-11-20 1973-08-13
JPS5040946A (en) * 1973-04-13 1975-04-15
JPS50145077A (en) * 1974-05-10 1975-11-21

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857584A (en) * 1971-11-20 1973-08-13
JPS5040946A (en) * 1973-04-13 1975-04-15
JPS50145077A (en) * 1974-05-10 1975-11-21

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