JPS5525432A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5525432A
JPS5525432A JP9773078A JP9773078A JPS5525432A JP S5525432 A JPS5525432 A JP S5525432A JP 9773078 A JP9773078 A JP 9773078A JP 9773078 A JP9773078 A JP 9773078A JP S5525432 A JPS5525432 A JP S5525432A
Authority
JP
Japan
Prior art keywords
containing silane
formula
alkylene
alkoxy
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9773078A
Other languages
Japanese (ja)
Inventor
Isao Kaetsu
Minoru Kumakura
Eiichi Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Atomic Energy Agency
Ichikoh Industries Ltd
Original Assignee
Japan Atomic Energy Research Institute
Ichikoh Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Atomic Energy Research Institute, Ichikoh Industries Ltd filed Critical Japan Atomic Energy Research Institute
Priority to JP9773078A priority Critical patent/JPS5525432A/en
Publication of JPS5525432A publication Critical patent/JPS5525432A/en
Pending legal-status Critical Current

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  • Silicon Polymers (AREA)

Abstract

PURPOSE: To provide the title composition giving a coating film having excellent abrasion resistance, surface hardness, chemical resistance, etc., composed mainly of a hydrolyzate of a mixture of a specific aminosilane, an epoxy-containing silane (polymer) and an alkoxy-containing silane.
CONSTITUTION: The title composition composed mainly of a component obtained by the co-hydrolysis of (A) an aminosilane compound of formula I, II, or III (R1 is ≤6C alkylene; R2 is ≤4C alkyl; R3 is OR2, ≤4C alkyl; R4 is 2W4C alkylene), (B) an epoxy-containing silane compound of formula IV or V or its polymer, and (C) an alkoxy-containing silane compound of formula VI or VII.
USE: The composition forms a colorless, transparent and uniform film when applied to a metal surface, especially to a metallized surface.
COPYRIGHT: (C)1980,JPO&Japio
JP9773078A 1978-08-10 1978-08-10 Thermosetting resin composition Pending JPS5525432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9773078A JPS5525432A (en) 1978-08-10 1978-08-10 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9773078A JPS5525432A (en) 1978-08-10 1978-08-10 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5525432A true JPS5525432A (en) 1980-02-23

Family

ID=14199997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9773078A Pending JPS5525432A (en) 1978-08-10 1978-08-10 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5525432A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198065A (en) * 1991-02-25 1993-03-30 Ciba-Geigy Corporation Method for bonding steel to wood using an epoxy primer and adhesive
JP2000109694A (en) * 1998-08-04 2000-04-18 Jsr Corp Photocurable resin composition and cured film
EP1134262A3 (en) * 2000-03-15 2002-12-18 Ishihara Chemical Co., Ltd. Colored, transparent film-forming composition, its coating method and removing method of a film thereof
JP2003064308A (en) * 2001-08-29 2003-03-05 Satoshi Sawamura Transparent silicone-based film-forming composition and method for curing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198065A (en) * 1991-02-25 1993-03-30 Ciba-Geigy Corporation Method for bonding steel to wood using an epoxy primer and adhesive
JP2000109694A (en) * 1998-08-04 2000-04-18 Jsr Corp Photocurable resin composition and cured film
EP1134262A3 (en) * 2000-03-15 2002-12-18 Ishihara Chemical Co., Ltd. Colored, transparent film-forming composition, its coating method and removing method of a film thereof
US6730240B2 (en) 2000-03-15 2004-05-04 Ishihara Chemical Co., Ltd. Colored, transparent film-forming composition, its coating method and removing method of a film thereof
JP2003064308A (en) * 2001-08-29 2003-03-05 Satoshi Sawamura Transparent silicone-based film-forming composition and method for curing the same

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