JPS5525468A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5525468A
JPS5525468A JP9884778A JP9884778A JPS5525468A JP S5525468 A JPS5525468 A JP S5525468A JP 9884778 A JP9884778 A JP 9884778A JP 9884778 A JP9884778 A JP 9884778A JP S5525468 A JPS5525468 A JP S5525468A
Authority
JP
Japan
Prior art keywords
composition
hydrolyzing
epoxy
alkyl
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9884778A
Other languages
Japanese (ja)
Inventor
Isao Kaetsu
Minoru Kumakura
Eiichi Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Atomic Energy Agency
Ichikoh Industries Ltd
Original Assignee
Japan Atomic Energy Research Institute
Ichikoh Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Atomic Energy Research Institute, Ichikoh Industries Ltd filed Critical Japan Atomic Energy Research Institute
Priority to JP9884778A priority Critical patent/JPS5525468A/en
Publication of JPS5525468A publication Critical patent/JPS5525468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)

Abstract

PURPOSE: To prepare the title composition giving a cured coating film having excellent adhesivity, abrasion resistance, hardness and chemical resistance, and useful as a coating agent, by hydrolyzing a product obtained by the reaction of a specific aminosilane compound with an epoxy-containing vinyl monomer.
CONSTITUTION: The objective composition is prepared by reacting (A) an aminosilane compound of formula I, II, or III (R1 is 1W6C alkylene; R2 is 1W4C alkyl; R3 is OR2 1W4C alkyl) and (B) an epoxy-containing vinyl monomer of formula IV (X is H, methyl) or its polymer, and hydrolyzing the reaction product. The composition is applied to the surface of a metal substrate, and cured at 30W200°C.
COPYRIGHT: (C)1980,JPO&Japio
JP9884778A 1978-08-14 1978-08-14 Thermosetting resin composition Pending JPS5525468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9884778A JPS5525468A (en) 1978-08-14 1978-08-14 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9884778A JPS5525468A (en) 1978-08-14 1978-08-14 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5525468A true JPS5525468A (en) 1980-02-23

Family

ID=14230627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9884778A Pending JPS5525468A (en) 1978-08-14 1978-08-14 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5525468A (en)

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