JPS5525461A - Resin composition for encapsulation of semiconductor - Google Patents
Resin composition for encapsulation of semiconductorInfo
- Publication number
- JPS5525461A JPS5525461A JP9865178A JP9865178A JPS5525461A JP S5525461 A JPS5525461 A JP S5525461A JP 9865178 A JP9865178 A JP 9865178A JP 9865178 A JP9865178 A JP 9865178A JP S5525461 A JPS5525461 A JP S5525461A
- Authority
- JP
- Japan
- Prior art keywords
- encapsulation
- resin composition
- resin
- semiconductor
- pref
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011342 resin composition Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To provide a resin composition having excellent heat conductivity, heat resistance, and electric insulation, suitable for the encapsulation of semiconductor elements, composed of an epoxy resin composition containing a specific powdery silicon carbide as a filler.
CONSTITUTION: A composition for the encapsulation of semiconductor elements, composed of (A) (pref. 50W10 wt% of) a resin component, and (B) (pref. 50W90 wt% of) silicon carbide powder having a particle diameter of ≤400μ and coated with a thin film of (a) epoxy novolac resin, (b) a phenol novolac resin and or an acid anhydride, and (c) a layer such as an insulating oxide layer, etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9865178A JPS5525461A (en) | 1978-08-15 | 1978-08-15 | Resin composition for encapsulation of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9865178A JPS5525461A (en) | 1978-08-15 | 1978-08-15 | Resin composition for encapsulation of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5525461A true JPS5525461A (en) | 1980-02-23 |
| JPS5545572B2 JPS5545572B2 (en) | 1980-11-18 |
Family
ID=14225399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9865178A Granted JPS5525461A (en) | 1978-08-15 | 1978-08-15 | Resin composition for encapsulation of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5525461A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63142025A (en) * | 1986-12-05 | 1988-06-14 | Toshiba Chem Corp | Resin composition for sealing use |
| WO2013187303A1 (en) * | 2012-06-12 | 2013-12-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
-
1978
- 1978-08-15 JP JP9865178A patent/JPS5525461A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63142025A (en) * | 1986-12-05 | 1988-06-14 | Toshiba Chem Corp | Resin composition for sealing use |
| WO2013187303A1 (en) * | 2012-06-12 | 2013-12-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
| CN104379668A (en) * | 2012-06-12 | 2015-02-25 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
| JPWO2013187303A1 (en) * | 2012-06-12 | 2016-02-04 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
| US9832870B2 (en) | 2012-06-12 | 2017-11-28 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5545572B2 (en) | 1980-11-18 |
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