JPS555929A - Semiconductor sealing epoxy resin composition - Google Patents

Semiconductor sealing epoxy resin composition

Info

Publication number
JPS555929A
JPS555929A JP7770778A JP7770778A JPS555929A JP S555929 A JPS555929 A JP S555929A JP 7770778 A JP7770778 A JP 7770778A JP 7770778 A JP7770778 A JP 7770778A JP S555929 A JPS555929 A JP S555929A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
semiconductor sealing
sealing epoxy
diaza
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7770778A
Other languages
Japanese (ja)
Inventor
Shunichi Hayashi
Matsuro Kanehara
Toku Nagasawa
Mikio Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP7770778A priority Critical patent/JPS555929A/en
Publication of JPS555929A publication Critical patent/JPS555929A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: An epoxy resin composition capable of improving the life of semiconductors sealed in a resin at a high temperature and humidity, comprising an epoxy resin, a phenol novolak, and 1,8-diaza-bicyclo(5.4.0)undecene.
CONSTITUTION: An epoxy resin composition comprising (A) a phenol novolak as a curing agent, (B) 1,8-diaza-bicyclo(5.4.0)undecene-7 or its derivative as a curing accelerator, and (C) an epoxy resin. The novolak is preferably used in an amount to give about 0.5W2.0, preferably about one, phenolic hydroxyl groups per epoxy group in the epoxy resin. A phenolate, 2-ethylhexanoate, or carbonate may be cited as the derivative.
COPYRIGHT: (C)1980,JPO&Japio
JP7770778A 1978-06-26 1978-06-26 Semiconductor sealing epoxy resin composition Pending JPS555929A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7770778A JPS555929A (en) 1978-06-26 1978-06-26 Semiconductor sealing epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7770778A JPS555929A (en) 1978-06-26 1978-06-26 Semiconductor sealing epoxy resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57077132A Division JPS57210647A (en) 1982-05-08 1982-05-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS555929A true JPS555929A (en) 1980-01-17

Family

ID=13641359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7770778A Pending JPS555929A (en) 1978-06-26 1978-06-26 Semiconductor sealing epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS555929A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694761A (en) * 1979-12-28 1981-07-31 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPS6086175A (en) * 1983-10-19 1985-05-15 Sumitomo Deyurezu Kk Epoxy resin powder coating material composition
JPS6088080A (en) * 1983-10-20 1985-05-17 Sumitomo Deyurezu Kk Powdered epoxy resin paint composition
JPH05256459A (en) * 1991-12-20 1993-10-05 Matsushita Electric Ind Co Ltd Cooker
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010898A (en) * 1973-06-04 1975-02-04
JPS5010897A (en) * 1973-06-04 1975-02-04
JPS50108400A (en) * 1974-02-01 1975-08-26

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010898A (en) * 1973-06-04 1975-02-04
JPS5010897A (en) * 1973-06-04 1975-02-04
JPS50108400A (en) * 1974-02-01 1975-08-26

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694761A (en) * 1979-12-28 1981-07-31 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPS6086175A (en) * 1983-10-19 1985-05-15 Sumitomo Deyurezu Kk Epoxy resin powder coating material composition
JPS6088080A (en) * 1983-10-20 1985-05-17 Sumitomo Deyurezu Kk Powdered epoxy resin paint composition
JPH05256459A (en) * 1991-12-20 1993-10-05 Matsushita Electric Ind Co Ltd Cooker
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

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