JPS5526697A - Pellet bonding device - Google Patents

Pellet bonding device

Info

Publication number
JPS5526697A
JPS5526697A JP9613779A JP9613779A JPS5526697A JP S5526697 A JPS5526697 A JP S5526697A JP 9613779 A JP9613779 A JP 9613779A JP 9613779 A JP9613779 A JP 9613779A JP S5526697 A JPS5526697 A JP S5526697A
Authority
JP
Japan
Prior art keywords
frame
press
deformation
guide
upper face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9613779A
Other languages
Japanese (ja)
Inventor
Fumio Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9613779A priority Critical patent/JPS5526697A/en
Publication of JPS5526697A publication Critical patent/JPS5526697A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To obtain a bonding device without causing any deformation by performing a bonding while pressing with a press plate a lead frame mounted on guide rails with a heat block placed therebetween.
CONSTITUTION: A guide rail 3 and 4 supported by support plates 8 and 9 are provided in the side of a heat block 1 having a cartridge heater 2 mounted in the center and a lead frame 7 is guided by the guide face 5 and 6. In order to prevent a deformation of the frame 7, frame press plates 13 and 14 are provided on the upper face of the rails 3 and 4 to press the upper face of the frame 7. A press plate 11 is provided in the vicinity of a positioning pin 10 passing through the rail 3 to block a press force applied in the lateral direction to the frame 7. With the device having the construction described above, a semiconductor pellet sucked and held by the end of collet 12 is pressed and adhered onto the tab of the frame 7.
COPYRIGHT: (C)1980,JPO&Japio
JP9613779A 1979-07-30 1979-07-30 Pellet bonding device Pending JPS5526697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9613779A JPS5526697A (en) 1979-07-30 1979-07-30 Pellet bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9613779A JPS5526697A (en) 1979-07-30 1979-07-30 Pellet bonding device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13364774A Division JPS5160160A (en) 1974-11-22 1974-11-22 BONDEING USOCHI

Publications (1)

Publication Number Publication Date
JPS5526697A true JPS5526697A (en) 1980-02-26

Family

ID=14156995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9613779A Pending JPS5526697A (en) 1979-07-30 1979-07-30 Pellet bonding device

Country Status (1)

Country Link
JP (1) JPS5526697A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223342A (en) * 1982-06-22 1983-12-24 Toshiba Corp Positioning device for lead frame
JPS59195756U (en) * 1983-06-15 1984-12-26 東芝精機株式会社 Light emitting element mounting device
US4504008A (en) * 1983-06-02 1985-03-12 At&T Technologies, Inc. Method and apparatus for reflowing solder stripes on articles
JPS618935A (en) * 1984-06-25 1986-01-16 Shinkawa Ltd Heating device for bonding device
JPS62188140U (en) * 1986-05-22 1987-11-30

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223342A (en) * 1982-06-22 1983-12-24 Toshiba Corp Positioning device for lead frame
US4504008A (en) * 1983-06-02 1985-03-12 At&T Technologies, Inc. Method and apparatus for reflowing solder stripes on articles
JPS59195756U (en) * 1983-06-15 1984-12-26 東芝精機株式会社 Light emitting element mounting device
JPS618935A (en) * 1984-06-25 1986-01-16 Shinkawa Ltd Heating device for bonding device
JPS62188140U (en) * 1986-05-22 1987-11-30

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