JPS5529563U - - Google Patents
Info
- Publication number
- JPS5529563U JPS5529563U JP11320778U JP11320778U JPS5529563U JP S5529563 U JPS5529563 U JP S5529563U JP 11320778 U JP11320778 U JP 11320778U JP 11320778 U JP11320778 U JP 11320778U JP S5529563 U JPS5529563 U JP S5529563U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978113207U JPS5831406Y2 (ja) | 1978-08-17 | 1978-08-17 | ボンデイングワイヤの送給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978113207U JPS5831406Y2 (ja) | 1978-08-17 | 1978-08-17 | ボンデイングワイヤの送給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5529563U true JPS5529563U (ja) | 1980-02-26 |
| JPS5831406Y2 JPS5831406Y2 (ja) | 1983-07-12 |
Family
ID=29062804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978113207U Expired JPS5831406Y2 (ja) | 1978-08-17 | 1978-08-17 | ボンデイングワイヤの送給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831406Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106579A (ja) * | 1974-01-09 | 1975-08-22 |
-
1978
- 1978-08-17 JP JP1978113207U patent/JPS5831406Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106579A (ja) * | 1974-01-09 | 1975-08-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831406Y2 (ja) | 1983-07-12 |