JPS5534252A - Adhesion composition - Google Patents

Adhesion composition

Info

Publication number
JPS5534252A
JPS5534252A JP10726178A JP10726178A JPS5534252A JP S5534252 A JPS5534252 A JP S5534252A JP 10726178 A JP10726178 A JP 10726178A JP 10726178 A JP10726178 A JP 10726178A JP S5534252 A JPS5534252 A JP S5534252A
Authority
JP
Japan
Prior art keywords
cresol
resin
adhesion composition
adhesion
formaldehyde
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10726178A
Other languages
Japanese (ja)
Inventor
Yasuhiro Kyotani
Tsutomu Hamada
Tsutomu Era
Sadahiro Shirakawa
Itsuo Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10726178A priority Critical patent/JPS5534252A/en
Publication of JPS5534252A publication Critical patent/JPS5534252A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An adhesion composition for metal that is composed of m-cresol-modified phenolic resin, polyvinyl butyral resin, epoxy resin and organic solvent, thus having high heat resistance, electric characteristics and adhesion.
CONSTITUTION: (a) a m-cresol-modified phenolic resin obtained by reacting a phenolic mixture containing 5W15wt%, based on the phenol, of m-cresol with formaldehyde in the presence of an ammonia catalyst so that the molar ratio of formaldehyde:phenols becomes 1.3W1.5:1, (b) a polyvinyl butyral resin, (c) an epoxy resin and (d) an organic solvent as acetone, butanol, toluene are mixed to give the objective adhesion composition for metal.
COPYRIGHT: (C)1980,JPO&Japio
JP10726178A 1978-08-31 1978-08-31 Adhesion composition Pending JPS5534252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10726178A JPS5534252A (en) 1978-08-31 1978-08-31 Adhesion composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10726178A JPS5534252A (en) 1978-08-31 1978-08-31 Adhesion composition

Publications (1)

Publication Number Publication Date
JPS5534252A true JPS5534252A (en) 1980-03-10

Family

ID=14454555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10726178A Pending JPS5534252A (en) 1978-08-31 1978-08-31 Adhesion composition

Country Status (1)

Country Link
JP (1) JPS5534252A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116981559A (en) * 2021-03-09 2023-10-31 Ddp特种电子材料美国有限责任公司 Advanced adhesives

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116981559A (en) * 2021-03-09 2023-10-31 Ddp特种电子材料美国有限责任公司 Advanced adhesives
CN116981559B (en) * 2021-03-09 2026-01-13 Ddp特种电子材料美国有限责任公司 Advanced adhesives

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