JPS5534453A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5534453A
JPS5534453A JP10704378A JP10704378A JPS5534453A JP S5534453 A JPS5534453 A JP S5534453A JP 10704378 A JP10704378 A JP 10704378A JP 10704378 A JP10704378 A JP 10704378A JP S5534453 A JPS5534453 A JP S5534453A
Authority
JP
Japan
Prior art keywords
lead
leads
inner point
lead frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10704378A
Other languages
English (en)
Japanese (ja)
Other versions
JPS633463B2 (2
Inventor
Katsuyoshi Miyairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10704378A priority Critical patent/JPS5534453A/ja
Publication of JPS5534453A publication Critical patent/JPS5534453A/ja
Publication of JPS633463B2 publication Critical patent/JPS633463B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP10704378A 1978-08-31 1978-08-31 Lead frame for semiconductor device Granted JPS5534453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10704378A JPS5534453A (en) 1978-08-31 1978-08-31 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10704378A JPS5534453A (en) 1978-08-31 1978-08-31 Lead frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5534453A true JPS5534453A (en) 1980-03-11
JPS633463B2 JPS633463B2 (2) 1988-01-23

Family

ID=14449064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10704378A Granted JPS5534453A (en) 1978-08-31 1978-08-31 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5534453A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764164U (2) * 1980-09-30 1982-04-16
JPS60123118A (ja) * 1983-12-06 1985-07-01 Toyo Commun Equip Co Ltd 圧電振動子等のパッケ−ジ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132264U (2) * 1974-08-30 1976-03-09
JPS522168A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Composite molding machine
JPS53100875U (2) * 1977-01-19 1978-08-15

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132264U (2) * 1974-08-30 1976-03-09
JPS522168A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Composite molding machine
JPS53100875U (2) * 1977-01-19 1978-08-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764164U (2) * 1980-09-30 1982-04-16
JPS60123118A (ja) * 1983-12-06 1985-07-01 Toyo Commun Equip Co Ltd 圧電振動子等のパッケ−ジ

Also Published As

Publication number Publication date
JPS633463B2 (2) 1988-01-23

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