JPS5534488A - Semiconductor device and its manufacturing method - Google Patents
Semiconductor device and its manufacturing methodInfo
- Publication number
- JPS5534488A JPS5534488A JP10787278A JP10787278A JPS5534488A JP S5534488 A JPS5534488 A JP S5534488A JP 10787278 A JP10787278 A JP 10787278A JP 10787278 A JP10787278 A JP 10787278A JP S5534488 A JPS5534488 A JP S5534488A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- crystal
- single crystal
- oxide membrane
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Static Random-Access Memory (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To heighten the integration density by making multi-crystalized semiconductor layer into three dimention structure with electrode wiring layer, thru the method wherein the process of growing single crystal semiconductor and the process of forming multi-crystal semiconductor layer among the former semiconductor layers are repeated. CONSTITUTION:Oxide membrane 2 is left in stripe form on a p-type crystal semiconductor substrate 1, while an n-type single crystal silicon layer 3 of high density is epitaxial grown and are made as IGFET source. Oxide membrane 4 is thickly formed covering whole surface, multi-crystal Si layer 5 is laminated at gate position, which is polish finished until the polishing reaches the upper surface of oxide membrane 4 and is etched selectively. By repeating the above procedures, single crystal Si layers 3,6,9 are made into source channel drain region, and IGFET is constructed three dimentionally wherein thin oxide membranes 7 are made into gate insulation membranes and multi-crystal Si layer 8 are made into gate electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53107872A JPS5852345B2 (en) | 1978-09-01 | 1978-09-01 | Semiconductor device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53107872A JPS5852345B2 (en) | 1978-09-01 | 1978-09-01 | Semiconductor device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5534488A true JPS5534488A (en) | 1980-03-11 |
| JPS5852345B2 JPS5852345B2 (en) | 1983-11-22 |
Family
ID=14470217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53107872A Expired JPS5852345B2 (en) | 1978-09-01 | 1978-09-01 | Semiconductor device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852345B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837948A (en) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | Laminated semiconductor memory device |
| JPS5884456A (en) * | 1981-10-27 | 1983-05-20 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Integrated circuit bipolar memory cell |
| JPS6461050A (en) * | 1987-09-01 | 1989-03-08 | Nec Corp | Semiconductor storage device |
| JPH06260593A (en) * | 1993-02-03 | 1994-09-16 | Internatl Business Mach Corp <Ibm> | Three-dimensional semiconductor and its preparation |
-
1978
- 1978-09-01 JP JP53107872A patent/JPS5852345B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837948A (en) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | Laminated semiconductor memory device |
| JPS5884456A (en) * | 1981-10-27 | 1983-05-20 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Integrated circuit bipolar memory cell |
| JPS6461050A (en) * | 1987-09-01 | 1989-03-08 | Nec Corp | Semiconductor storage device |
| JPH06260593A (en) * | 1993-02-03 | 1994-09-16 | Internatl Business Mach Corp <Ibm> | Three-dimensional semiconductor and its preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5852345B2 (en) | 1983-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5636143A (en) | Manufacture of semiconductor device | |
| JPS6450554A (en) | Manufacture of complementary semiconductor device | |
| IE833068L (en) | Producing a semiconductor device having isolation regions¹between elements | |
| JPH0456471B2 (en) | ||
| JPS54154977A (en) | Semiconductor device and its manufacture | |
| JPS54157485A (en) | Planar semiconductor device | |
| JPS5710268A (en) | Semiconductor device | |
| JPS5617071A (en) | Semiconductor device | |
| JPS5420678A (en) | Production of silicon monocrystaline island regions | |
| JPS6430270A (en) | Manufacture of insulated-gate semiconductor device | |
| JPS57196542A (en) | Semiconductor integrated circuit device and manufacture thereof | |
| JPS55153342A (en) | Semiconductor device and its manufacture | |
| JPS6430271A (en) | Manufacture of insulated-gate semiconductor device | |
| JPS5783042A (en) | Manufacture of semiconductor device | |
| JPS5742165A (en) | Manufacture of mis type field effect transistor device | |
| JPS5693370A (en) | Manufacture of mos-type semiconductor device | |
| JPS54117690A (en) | Production of semiconductor device | |
| JPS5492180A (en) | Manufacture of semiconductor device | |
| JPS57184248A (en) | Manufacture of semiconductor device | |
| JPS6094738A (en) | Semiconductor substrate | |
| JPS60752A (en) | Manufacture of semiconductor device | |
| JPS55141752A (en) | Semiconductor device and fabricating method of the same | |
| JPS5771170A (en) | Manufacture of complementary mos semiconductor device | |
| JPS6467936A (en) | Manufacture of semiconductor device | |
| JPS5596652A (en) | Method of fabricating semiconductor device |