JPS553611A - Resin flash eliminating method - Google Patents

Resin flash eliminating method

Info

Publication number
JPS553611A
JPS553611A JP7419478A JP7419478A JPS553611A JP S553611 A JPS553611 A JP S553611A JP 7419478 A JP7419478 A JP 7419478A JP 7419478 A JP7419478 A JP 7419478A JP S553611 A JPS553611 A JP S553611A
Authority
JP
Japan
Prior art keywords
resin
header
flash
covering
moulding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7419478A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Tokio Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7419478A priority Critical patent/JPS553611A/en
Publication of JPS553611A publication Critical patent/JPS553611A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:Resin flashes which may be produced when a resin mouldng is carried out by inserting electronic parts into a metal mould can be easily removed by taking off a covering provided in advance on the portion wherein resin flashes may be produced after moudling, together with the resin deposited thereon during moulding. CONSTITUTION:Resin moulding is conducted by mounting a metallic header 12 on a resin package 10 having projection leads 16 and inserting it into a metal mould. At this juncture, the surface of the header 12 is exposed to the outside of the package 10, and the surface of the header 12 is adhered closely to the inside of cavity within the metal mould. However, an undesired gap is formed therebetween due to errors in dimension or transformation, and a resin will enter this cap to produce the resin flash 18 to be removed afterwards. Consequently, the flash 18 can be removed together with a covering after moulding, if there is provided such a covering as indicated by 14, made of photosensitive resist or photosensitive polyimide resin, in advance on the surface of the header 12 on which the flash 18 may be deposited.
JP7419478A 1978-06-21 1978-06-21 Resin flash eliminating method Pending JPS553611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7419478A JPS553611A (en) 1978-06-21 1978-06-21 Resin flash eliminating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7419478A JPS553611A (en) 1978-06-21 1978-06-21 Resin flash eliminating method

Publications (1)

Publication Number Publication Date
JPS553611A true JPS553611A (en) 1980-01-11

Family

ID=13540116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7419478A Pending JPS553611A (en) 1978-06-21 1978-06-21 Resin flash eliminating method

Country Status (1)

Country Link
JP (1) JPS553611A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832261U (en) * 1981-08-20 1983-03-02 東芝熱器具株式会社 Abnormality detection device for combustion equipment
US5070041A (en) * 1988-08-12 1991-12-03 Mitsui Petrochemical Industries, Ltd. Method of removing flash from a semiconductor leadframe using coated leadframe and solvent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832261U (en) * 1981-08-20 1983-03-02 東芝熱器具株式会社 Abnormality detection device for combustion equipment
US5070041A (en) * 1988-08-12 1991-12-03 Mitsui Petrochemical Industries, Ltd. Method of removing flash from a semiconductor leadframe using coated leadframe and solvent

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