JPS5521126A - Marking method in resin mold parts - Google Patents

Marking method in resin mold parts

Info

Publication number
JPS5521126A
JPS5521126A JP9360578A JP9360578A JPS5521126A JP S5521126 A JPS5521126 A JP S5521126A JP 9360578 A JP9360578 A JP 9360578A JP 9360578 A JP9360578 A JP 9360578A JP S5521126 A JPS5521126 A JP S5521126A
Authority
JP
Japan
Prior art keywords
mold
mold member
face
circumference
mold parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9360578A
Other languages
Japanese (ja)
Inventor
Hidetoshi Mochizuki
Keizo Otsuki
Akira Suzuki
Yoshio Adachi
Hideki Kosaka
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9360578A priority Critical patent/JPS5521126A/en
Publication of JPS5521126A publication Critical patent/JPS5521126A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Abstract

PURPOSE: To perform a marking in the central portion of the upper and lower face of a mold member by taking mold parts from the upper and lower mold members with an ejecter pin projected to the circumference of the upper and lower face of the mold member in taking the mold parts after a mold processing.
CONSTITUTION: A semiconductor element 21 is fixed to a tab lead 20, a lead frame 24 connected by a wire 23 to the inner end of anelectrode lead 22 of the semiconductor element 21 is interposed between an upper and lower mold member 25 and 26 to be molded after tightening. Thereafter, the mold member is opened and the mold parts are taken from the upper and lower mold member 25 and 26 by projecting an ejector pin 27 and 28 from the cavity bottom face of the mold member 25 and 26. In this case, the ejector pin 27 and 28 are provided in the circumference of a mold member 29 so that they press the circumference of the mold 29 and the upper and lower central face of the mold member 29 is formed flat and a mark 31 is indicated on the flat face.
COPYRIGHT: (C)1980,JPO&Japio
JP9360578A 1978-08-02 1978-08-02 Marking method in resin mold parts Pending JPS5521126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9360578A JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9360578A JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59152890A Division JPS60121742A (en) 1984-07-25 1984-07-25 Marking method in resin molded product

Publications (1)

Publication Number Publication Date
JPS5521126A true JPS5521126A (en) 1980-02-15

Family

ID=14086951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9360578A Pending JPS5521126A (en) 1978-08-02 1978-08-02 Marking method in resin mold parts

Country Status (1)

Country Link
JP (1) JPS5521126A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219056A (en) * 1982-06-16 1983-12-20 Hitachi Ltd Stamping method for hybrid integrated circuits
US6294411B1 (en) 1996-10-25 2001-09-25 Nippon Steel Semiconductor Corporation Method for molding a semiconductor device utilizing a satin finish

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219056A (en) * 1982-06-16 1983-12-20 Hitachi Ltd Stamping method for hybrid integrated circuits
US6294411B1 (en) 1996-10-25 2001-09-25 Nippon Steel Semiconductor Corporation Method for molding a semiconductor device utilizing a satin finish

Similar Documents

Publication Publication Date Title
JPS55128835A (en) Molding method and mold used therefor
JPS5559749A (en) Lead frame
JPS5521126A (en) Marking method in resin mold parts
JPS5294074A (en) Leading-in frame
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5228869A (en) Process for molding and the mold and heat-radiation header for the pro cess
JPS5558557A (en) Resin mold type electronic component and lead frame used therefor
JPS5519848A (en) Semiconductor element molding die
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS5298472A (en) Lead frame for resin molding
JPS54107261A (en) Production of resin seal-type semiconductor device and lead frame used in this production
JPS5369581A (en) Manufacture for resin sealed type semiconductor device
JPS6450454A (en) Manufacture of lead frame and semiconductor device
JPS55139241A (en) Resin molding machine of substrate
JPS51119057A (en) Manufacturing method of polyvinyl alcohol molded products
JPS5569421A (en) Modling of frame for electric appliance
JPS57191011A (en) Mold
JPS5410920A (en) Preparing molded transformer
JPS53104171A (en) Mold for semiconductor device
JPS5662347A (en) Production of resin molded ic
JPS54101264A (en) Semiconductor device
JPS5242372A (en) Process for production of semiconductor device
JPS5724233A (en) Integral molding method for tabular body
JPS5394179A (en) Lead frame
JPS6454752A (en) Pin grid array semiconductor package