JPS553617A - Metallic base for hybrid integrated circuit - Google Patents

Metallic base for hybrid integrated circuit

Info

Publication number
JPS553617A
JPS553617A JP7422178A JP7422178A JPS553617A JP S553617 A JPS553617 A JP S553617A JP 7422178 A JP7422178 A JP 7422178A JP 7422178 A JP7422178 A JP 7422178A JP S553617 A JPS553617 A JP S553617A
Authority
JP
Japan
Prior art keywords
integrated circuit
metallic base
hybrid integrated
hybrid
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7422178A
Other languages
Japanese (ja)
Other versions
JPS5757866B2 (en
Inventor
Terumi Nakazawa
Tadao Suzuki
Hitoshi Minorikawa
Kenji Tabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7422178A priority Critical patent/JPS553617A/en
Publication of JPS553617A publication Critical patent/JPS553617A/en
Publication of JPS5757866B2 publication Critical patent/JPS5757866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Casings For Electric Apparatus (AREA)
JP7422178A 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit Granted JPS553617A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7422178A JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7422178A JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS553617A true JPS553617A (en) 1980-01-11
JPS5757866B2 JPS5757866B2 (en) 1982-12-07

Family

ID=13540906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7422178A Granted JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS553617A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882550A (en) * 1981-11-10 1983-05-18 Fujitsu Ltd Heat radiating structure of heat sink
JPH03224251A (en) * 1989-12-19 1991-10-03 Fujitsu Ltd Semiconductor device
JPH0470752U (en) * 1990-10-30 1992-06-23
WO2018055667A1 (en) * 2016-09-20 2018-03-29 三菱電機株式会社 Semiconductor device
JP2019216216A (en) * 2018-06-14 2019-12-19 Ｎｅｃスペーステクノロジー株式会社 Manufacturing method for semiconductor device and semiconductor device
WO2020050093A1 (en) * 2018-09-03 2020-03-12 日立オートモティブシステムズ株式会社 Electronic control device
WO2020255558A1 (en) * 2019-06-21 2020-12-24 株式会社ケーヒン Power conversion device
JPWO2021106114A1 (en) * 2019-11-27 2021-06-03

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828299A (en) * 1971-08-16 1973-04-14
JPS4878072U (en) * 1971-12-24 1973-09-26
JPS4979468A (en) * 1972-12-04 1974-07-31

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828299A (en) * 1971-08-16 1973-04-14
JPS4878072U (en) * 1971-12-24 1973-09-26
JPS4979468A (en) * 1972-12-04 1974-07-31

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882550A (en) * 1981-11-10 1983-05-18 Fujitsu Ltd Heat radiating structure of heat sink
JPH03224251A (en) * 1989-12-19 1991-10-03 Fujitsu Ltd Semiconductor device
JPH0470752U (en) * 1990-10-30 1992-06-23
WO2018055667A1 (en) * 2016-09-20 2018-03-29 三菱電機株式会社 Semiconductor device
JPWO2018055667A1 (en) * 2016-09-20 2019-02-28 三菱電機株式会社 Semiconductor device
US10748830B2 (en) 2016-09-20 2020-08-18 Mitsubishi Electric Corporation Semiconductor device
JP2019216216A (en) * 2018-06-14 2019-12-19 Ｎｅｃスペーステクノロジー株式会社 Manufacturing method for semiconductor device and semiconductor device
JPWO2020050093A1 (en) * 2018-09-03 2021-08-26 日立Astemo株式会社 Electronic control device
WO2020050093A1 (en) * 2018-09-03 2020-03-12 日立オートモティブシステムズ株式会社 Electronic control device
US12018710B2 (en) 2018-09-03 2024-06-25 Hitachi Astemo, Ltd. Electronic control unit
WO2020255558A1 (en) * 2019-06-21 2020-12-24 株式会社ケーヒン Power conversion device
US12074532B2 (en) 2019-06-21 2024-08-27 Hitachi Astemo, Ltd. Power conversion device
WO2021106114A1 (en) * 2019-11-27 2021-06-03 三菱電機株式会社 Semiconductor module
CN114730745A (en) * 2019-11-27 2022-07-08 三菱电机株式会社 Semiconductor module
JPWO2021106114A1 (en) * 2019-11-27 2021-06-03
US12131969B2 (en) 2019-11-27 2024-10-29 Mitsubishi Electric Corporation Semiconductor module
CN114730745B (en) * 2019-11-27 2025-09-05 三菱电机株式会社 semiconductor modules

Also Published As

Publication number Publication date
JPS5757866B2 (en) 1982-12-07

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