JPS5536215A - Transfer molding composition - Google Patents

Transfer molding composition

Info

Publication number
JPS5536215A
JPS5536215A JP10859578A JP10859578A JPS5536215A JP S5536215 A JPS5536215 A JP S5536215A JP 10859578 A JP10859578 A JP 10859578A JP 10859578 A JP10859578 A JP 10859578A JP S5536215 A JPS5536215 A JP S5536215A
Authority
JP
Japan
Prior art keywords
resin
novolak resin
phenol
silicon carbide
finely divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10859578A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akira Yoshizumi
Kazutaka Matsumoto
Mitsuo Yaegashi
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10859578A priority Critical patent/JPS5536215A/en
Publication of JPS5536215A publication Critical patent/JPS5536215A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The title composition usable for manufacturing molded articles having a high thermal consuctivity, comprising (A) a resin composition of an epoxy novolak resin, its brominated resin and phenol-novolak resin, and (B) a finely divided silicon carbide.
CONSTITUTION: (B) 45W85wt% of finely divided silicon carbide powder having a particle size ≤400 μm is melt kneaded with (A) 55W15wt% of the resin ingredient of (a) an epoxy novolak resin, (b) a phenol-novolak resin at a weight ratio of 1/3W 3:1, and (c) 10W40wt% of a brominated epoxy novolak resin by hot rolls.
EFFECT: Uniform and dense molded anticles having improved flame retaradancy, heat resistance, free from precipitation and setting of fillers in storage and curing can be obtained according to the method.
COPYRIGHT: (C)1980,JPO&Japio
JP10859578A 1978-09-06 1978-09-06 Transfer molding composition Pending JPS5536215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10859578A JPS5536215A (en) 1978-09-06 1978-09-06 Transfer molding composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10859578A JPS5536215A (en) 1978-09-06 1978-09-06 Transfer molding composition

Publications (1)

Publication Number Publication Date
JPS5536215A true JPS5536215A (en) 1980-03-13

Family

ID=14488781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10859578A Pending JPS5536215A (en) 1978-09-06 1978-09-06 Transfer molding composition

Country Status (1)

Country Link
JP (1) JPS5536215A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222847A (en) * 1985-07-23 1987-01-31 Toshiba Chem Corp Resin composition for laminated sheet
JPS63142025A (en) * 1986-12-05 1988-06-14 Toshiba Chem Corp Resin composition for sealing use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222847A (en) * 1985-07-23 1987-01-31 Toshiba Chem Corp Resin composition for laminated sheet
JPS63142025A (en) * 1986-12-05 1988-06-14 Toshiba Chem Corp Resin composition for sealing use

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