JPS5536224A - Laminate - Google Patents

Laminate

Info

Publication number
JPS5536224A
JPS5536224A JP10887978A JP10887978A JPS5536224A JP S5536224 A JPS5536224 A JP S5536224A JP 10887978 A JP10887978 A JP 10887978A JP 10887978 A JP10887978 A JP 10887978A JP S5536224 A JPS5536224 A JP S5536224A
Authority
JP
Japan
Prior art keywords
resin
polybutadiene
varnish
impregnated
touch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10887978A
Other languages
Japanese (ja)
Inventor
Norio Saruwatari
Isao Watanabe
Kazumasa Saito
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10887978A priority Critical patent/JPS5536224A/en
Publication of JPS5536224A publication Critical patent/JPS5536224A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: A laminate suitable for printed circuit base boards having improved electrical properties and heat resistance, manufactured by compression-molding prepreg sheets, which are obtained through application of 1, 2-polybutadiene to sheet base materials, impregnated with a resin having excellent adhesivity.
CONSTITUTION: Sheet base materials, e.g. glass cloth, are impregnated with a varnish, prepared by dissolving a resin, e.g. epoxy-modified imide having excellent adheasivity and the heat resistance similar to 1,2-polybutadiene in a solvent, to give a resin add-on of 5W30wt% based on the total resin, and dried to set to touch. The prepreg sheets thus obtained are then coated with a varnish comprising a liquid 1, 2-polybutadiene having 60% or more of pendant double bond units and an avarage molecular weight ≤5,000, a solvent, e.g. toluene, and 0.1W10wt% of a radical polymerization initiator, and dried at 80W150°C to set to touch. One or plural sheets thus obtained are placed on top of each other, and compression-molded at 100W200°C.
COPYRIGHT: (C)1980,JPO&Japio
JP10887978A 1978-09-04 1978-09-04 Laminate Pending JPS5536224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10887978A JPS5536224A (en) 1978-09-04 1978-09-04 Laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10887978A JPS5536224A (en) 1978-09-04 1978-09-04 Laminate

Publications (1)

Publication Number Publication Date
JPS5536224A true JPS5536224A (en) 1980-03-13

Family

ID=14495892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10887978A Pending JPS5536224A (en) 1978-09-04 1978-09-04 Laminate

Country Status (1)

Country Link
JP (1) JPS5536224A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136295A (en) * 1983-12-23 1985-07-19 セイコーエプソン株式会社 Additive multilayer printed circuit board
WO1991004284A1 (en) * 1989-09-20 1991-04-04 Hitachi, Ltd. Hexafluorobutadiene prepolymer, production thereof, polymerizable composition, and laminate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136295A (en) * 1983-12-23 1985-07-19 セイコーエプソン株式会社 Additive multilayer printed circuit board
WO1991004284A1 (en) * 1989-09-20 1991-04-04 Hitachi, Ltd. Hexafluorobutadiene prepolymer, production thereof, polymerizable composition, and laminate

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