JPS5474884A - Preparation of copper-clad laminate - Google Patents

Preparation of copper-clad laminate

Info

Publication number
JPS5474884A
JPS5474884A JP14215677A JP14215677A JPS5474884A JP S5474884 A JPS5474884 A JP S5474884A JP 14215677 A JP14215677 A JP 14215677A JP 14215677 A JP14215677 A JP 14215677A JP S5474884 A JPS5474884 A JP S5474884A
Authority
JP
Japan
Prior art keywords
copper foil
butadiene
copper
styrene copolymer
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14215677A
Other languages
Japanese (ja)
Other versions
JPS5847979B2 (en
Inventor
Norio Musumeto
Katsura Adachi
Takenori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP52142156A priority Critical patent/JPS5847979B2/en
Publication of JPS5474884A publication Critical patent/JPS5474884A/en
Publication of JPS5847979B2 publication Critical patent/JPS5847979B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To prepare a copper-clad laminate having excellent heat resistance and high adhesive strength of the copper foil, by laminating a prepreg sheet to a copper foil coated with a specific 1,2-butadiene-styrene copolymer.
CONSTITUTION: A prepreg sheet obtained by impregnating a sheet substrate such as glass cloth, synthetic fiber non-woven fabrics, etc., with a thermosetting resin, is laminated with a copper foil coated with a 1,2-butadiene-styrene copolymer having a number average molecular weight of 2000W5000 and containing ≥50% of 1,2-butadiene unit having a side chain double bond, in the main chain, to a thickness of 5W100μ, and pressed under proper temperature and pressure.
EFFECT: The peeling strength of the copper foil is remarkably improved without lowering the original dielectric properties of the substrate.
USE: Printed circuit board for electrionic apparatus.
COPYRIGHT: (C)1979,JPO&Japio
JP52142156A 1977-11-29 1977-11-29 Manufacturing method for copper-clad laminates Expired JPS5847979B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52142156A JPS5847979B2 (en) 1977-11-29 1977-11-29 Manufacturing method for copper-clad laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52142156A JPS5847979B2 (en) 1977-11-29 1977-11-29 Manufacturing method for copper-clad laminates

Publications (2)

Publication Number Publication Date
JPS5474884A true JPS5474884A (en) 1979-06-15
JPS5847979B2 JPS5847979B2 (en) 1983-10-26

Family

ID=15308656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52142156A Expired JPS5847979B2 (en) 1977-11-29 1977-11-29 Manufacturing method for copper-clad laminates

Country Status (1)

Country Link
JP (1) JPS5847979B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby
CN111559138A (en) * 2020-05-28 2020-08-21 珠海国能复合材料科技有限公司 Olefin-based copper-clad plate
CN111605267A (en) * 2020-05-28 2020-09-01 珠海国能新材料股份有限公司 Flame-retardant olefin substrate and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby
CN111559138A (en) * 2020-05-28 2020-08-21 珠海国能复合材料科技有限公司 Olefin-based copper-clad plate
CN111605267A (en) * 2020-05-28 2020-09-01 珠海国能新材料股份有限公司 Flame-retardant olefin substrate and preparation method thereof

Also Published As

Publication number Publication date
JPS5847979B2 (en) 1983-10-26

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