JPS5538017A - Manufacturing of semiconductor memory device - Google Patents
Manufacturing of semiconductor memory deviceInfo
- Publication number
- JPS5538017A JPS5538017A JP11050478A JP11050478A JPS5538017A JP S5538017 A JPS5538017 A JP S5538017A JP 11050478 A JP11050478 A JP 11050478A JP 11050478 A JP11050478 A JP 11050478A JP S5538017 A JPS5538017 A JP S5538017A
- Authority
- JP
- Japan
- Prior art keywords
- film
- silicon nitride
- polysilicon layer
- mask
- nitride film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
Landscapes
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
PURPOSE:To form a silicon gate type MNOS memory with good integration efficiency by utilizing self-alignment method using a polysilicon layer as a mask. CONSTITUTION:F field oxidation film 2 on surface of a P-type Si base plate 1 is etched to uncover an element-forming region, and on this surface, a three-layer structure which is composed of a gate oxide film 3, a silicon nitride film 4 and a polysilicon layer 5 is formed by etching process using a photoresist mask 9. And, only the silicon nitride film 4 is side-etched to prepare a narrow-width silicon nitride film 4' and an entire surface of the Si base plate is oxidized to form an SiO2 film 10. And then, the SiO2 film 10, except its side, is removed. As ion is injected using the polysilicon layer 5 as a mask and respective regions of an n-type source 6 and a drain 7 are formed by self-alignment method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050478A JPS5538017A (en) | 1978-09-08 | 1978-09-08 | Manufacturing of semiconductor memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050478A JPS5538017A (en) | 1978-09-08 | 1978-09-08 | Manufacturing of semiconductor memory device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5538017A true JPS5538017A (en) | 1980-03-17 |
Family
ID=14537437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11050478A Pending JPS5538017A (en) | 1978-09-08 | 1978-09-08 | Manufacturing of semiconductor memory device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5538017A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58202576A (en) * | 1982-05-21 | 1983-11-25 | Nec Corp | Insulated gate type field-effect transistor |
-
1978
- 1978-09-08 JP JP11050478A patent/JPS5538017A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58202576A (en) * | 1982-05-21 | 1983-11-25 | Nec Corp | Insulated gate type field-effect transistor |
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