JPS5539617A - Manufacturing of glass mold type diode - Google Patents
Manufacturing of glass mold type diodeInfo
- Publication number
- JPS5539617A JPS5539617A JP11223978A JP11223978A JPS5539617A JP S5539617 A JPS5539617 A JP S5539617A JP 11223978 A JP11223978 A JP 11223978A JP 11223978 A JP11223978 A JP 11223978A JP S5539617 A JPS5539617 A JP S5539617A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- glass
- covered
- pellet
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 5
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract 4
- 235000014676 Phragmites communis Nutrition 0.000 abstract 3
- 239000008188 pellet Substances 0.000 abstract 3
- 239000002002 slurry Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Landscapes
- Weting (AREA)
Abstract
PURPOSE: To obtain a glass sealed diode which has good reverse direction characteristics by covering with an Ag-Cu solder prior to an etching of an assembly, and then immersing in an etching agent.
CONSTITUTION: A Cu reed 11 and a Mo electrode 13 are combined by means of Ag-Cu solder 12, then covered with a glass slurry 21 and the slurry is fired. A pellet 22 is fixed by means of a high temperature treatment to the electrode reed covered with the glass, and this assembly is etched in an acid for obtaining a required reverse direction withstand voltage. Then the pellet is covered with a glass slurry and it is fired. By so doing, the solder is not etched when the assembly is etched because the Ag-Cu solder is covered. Thus Ag or Cu is prevented from adhering on the pellet. This increases reverse direction withstand voltage. In addition, the Ag-Cu solder enables to obtain a glass sealed diode that has good antimoisture characteristics and adhesiveness between a reed and an electrode.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11223978A JPS5539617A (en) | 1978-09-14 | 1978-09-14 | Manufacturing of glass mold type diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11223978A JPS5539617A (en) | 1978-09-14 | 1978-09-14 | Manufacturing of glass mold type diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5539617A true JPS5539617A (en) | 1980-03-19 |
Family
ID=14581718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11223978A Pending JPS5539617A (en) | 1978-09-14 | 1978-09-14 | Manufacturing of glass mold type diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5539617A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62502813A (en) * | 1985-05-10 | 1987-11-12 | トレフイメト− | New alloys with high electrical and mechanical properties, processes for their production and their use in particular in electrical, electronic and related fields |
| JPS62296304A (en) * | 1986-06-16 | 1987-12-23 | 古河電気工業株式会社 | Composite for electronic/electric equipment and manufacture thereof |
| JPH0320815U (en) * | 1989-07-12 | 1991-02-28 |
-
1978
- 1978-09-14 JP JP11223978A patent/JPS5539617A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62502813A (en) * | 1985-05-10 | 1987-11-12 | トレフイメト− | New alloys with high electrical and mechanical properties, processes for their production and their use in particular in electrical, electronic and related fields |
| JPS62296304A (en) * | 1986-06-16 | 1987-12-23 | 古河電気工業株式会社 | Composite for electronic/electric equipment and manufacture thereof |
| JPH0320815U (en) * | 1989-07-12 | 1991-02-28 |
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