JPS558085A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS558085A
JPS558085A JP8131578A JP8131578A JPS558085A JP S558085 A JPS558085 A JP S558085A JP 8131578 A JP8131578 A JP 8131578A JP 8131578 A JP8131578 A JP 8131578A JP S558085 A JPS558085 A JP S558085A
Authority
JP
Japan
Prior art keywords
tool
wire
electrode
bond section
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8131578A
Other languages
Japanese (ja)
Inventor
Kenichi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8131578A priority Critical patent/JPS558085A/en
Publication of JPS558085A publication Critical patent/JPS558085A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make a loose wire straight at the second bond section by moving a tool beyond the second bond section and reversing it when moving the bonding tool into the second bond section.
CONSTITUTION: A wire 3 is through the bonding tool 1 and the wire 3 is pressurized and attached to the external electrode 4 at the point of the tool 1. Then, while the wire 3 is drawn out from a through-hole the tool 1 is moved on a semiconductor 6, when the tool 1 is moved beyond the electrode 7 at the second bond and the tool 1 is reversed into the electrode 7 at course 8. The wire 3 drown out too much from the through-hole 2 is staighten up at the second bond section with the bending power obtained when the tool 1 moved back to the electrode 7. As a result, the insulating space between the wire 3 and the semiconductor chip at the second bond section is maintained to make it very difficult to short.
COPYRIGHT: (C)1980,JPO&Japio
JP8131578A 1978-07-03 1978-07-03 Wire bonding method Pending JPS558085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8131578A JPS558085A (en) 1978-07-03 1978-07-03 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8131578A JPS558085A (en) 1978-07-03 1978-07-03 Wire bonding method

Publications (1)

Publication Number Publication Date
JPS558085A true JPS558085A (en) 1980-01-21

Family

ID=13742951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8131578A Pending JPS558085A (en) 1978-07-03 1978-07-03 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS558085A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010737A (en) * 1983-06-30 1985-01-19 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS62108533A (en) * 1985-11-06 1987-05-19 Matsushita Electric Ind Co Ltd Wire bonding method
JP2018121000A (en) * 2017-01-27 2018-08-02 日亜化学工業株式会社 Method for manufacturing light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010737A (en) * 1983-06-30 1985-01-19 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS62108533A (en) * 1985-11-06 1987-05-19 Matsushita Electric Ind Co Ltd Wire bonding method
JP2018121000A (en) * 2017-01-27 2018-08-02 日亜化学工業株式会社 Method for manufacturing light-emitting device
US10181452B2 (en) 2017-01-27 2019-01-15 Nichia Corporation Method for manufacturing light-emitting device

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