JPS5541739A - Micro-projection type mask alignment device - Google Patents

Micro-projection type mask alignment device

Info

Publication number
JPS5541739A
JPS5541739A JP11464278A JP11464278A JPS5541739A JP S5541739 A JPS5541739 A JP S5541739A JP 11464278 A JP11464278 A JP 11464278A JP 11464278 A JP11464278 A JP 11464278A JP S5541739 A JPS5541739 A JP S5541739A
Authority
JP
Japan
Prior art keywords
mask
light
micro
wafer
alignment device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11464278A
Other languages
Japanese (ja)
Other versions
JPS6227536B2 (en
Inventor
Mitsuyoshi Koizumi
Nobuyuki Akiyama
Yoshimasa Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11464278A priority Critical patent/JPS5541739A/en
Publication of JPS5541739A publication Critical patent/JPS5541739A/en
Publication of JPS6227536B2 publication Critical patent/JPS6227536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE: To provide a micro-projection type mask alignment device by which checked patterns formed in the surface of a semiconductor wafer can be located in the least divergence by controlling X-, Y-, θ-table systems in accordance with light projected to the patterns through a mask and light reflected from the wafer.
CONSTITUTION: A semiconductor wafer 3 having checked patterns is placed on a table 28 comprising an X-table 28a, Y-table 28b and a rotary θ-table 28c, over which is placed a freely rotating mask 1 having alignment marks 6 with a micro- projection lens 2 provided inbetween. The amsk 1 is exposed to light by way of an optical fiber 48a having a condenser lens 47a and a mirror 46a from one side and at the same time, another optical fiber 48b from the other side. Thereupon, the light passed through the mask 1 and reflected from the wafer 3 is subjected to detection, using light-receptive elements 24 and 25 of detectors 45a and 45b, respectively, so that the table 28 can be moved in accordance with deviations against an optical axis 34 of a projection lens 4 provided above the mask 1.
COPYRIGHT: (C)1980,JPO&Japio
JP11464278A 1978-09-20 1978-09-20 Micro-projection type mask alignment device Granted JPS5541739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11464278A JPS5541739A (en) 1978-09-20 1978-09-20 Micro-projection type mask alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11464278A JPS5541739A (en) 1978-09-20 1978-09-20 Micro-projection type mask alignment device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP59157541A Division JPS60196944A (en) 1984-07-30 1984-07-30 Method for detecting pattern positioned on wafer
JP61104659A Division JPS62122129A (en) 1986-05-09 1986-05-09 Detector for position of pattern on wafer

Publications (2)

Publication Number Publication Date
JPS5541739A true JPS5541739A (en) 1980-03-24
JPS6227536B2 JPS6227536B2 (en) 1987-06-15

Family

ID=14642904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11464278A Granted JPS5541739A (en) 1978-09-20 1978-09-20 Micro-projection type mask alignment device

Country Status (1)

Country Link
JP (1) JPS5541739A (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102823A (en) * 1980-01-19 1981-08-17 Nippon Kogaku Kk <Nikon> Positioning device
JPS5780724A (en) * 1980-11-07 1982-05-20 Nippon Kogaku Kk <Nikon> Positioning device
JPS57142612A (en) * 1981-02-27 1982-09-03 Nippon Kogaku Kk <Nikon> Alignment optical system of projection type exposure device
JPS5825638A (en) * 1981-08-08 1983-02-15 Canon Inc Exposing device
JPS5828748A (en) * 1981-08-13 1983-02-19 Nippon Kogaku Kk <Nikon> Positioning device for transcribing device
JPS5856330A (en) * 1981-09-30 1983-04-04 Hitachi Ltd Exposing device in contracted manner
JPS58165326A (en) * 1982-03-09 1983-09-30 ウロマスク Device for matching integrated circuit producing machine
JPS5927525A (en) * 1982-08-03 1984-02-14 Canon Inc Alignment method
JPS5994825A (en) * 1982-11-24 1984-05-31 Nec Corp Alignment method for semiconductor wafer
JPS59101829A (en) * 1982-12-01 1984-06-12 Canon Inc Arranging method of alignment mark
JPS6054437A (en) * 1983-09-05 1985-03-28 Hitachi Ltd Positioning method of wafer to reticle
JPS60102739A (en) * 1983-11-10 1985-06-06 Canon Inc Baking and exposure device for semiconductor
JPS60256002A (en) * 1984-06-01 1985-12-17 Nippon Kogaku Kk <Nikon> Position detecting apparatus
JPS60262423A (en) * 1984-06-11 1985-12-25 Nippon Kogaku Kk <Nikon> Position detector
JPS61123139A (en) * 1985-10-11 1986-06-11 Canon Inc Alignment apparatus
JPS62169329A (en) * 1986-12-09 1987-07-25 Canon Inc Alignment method
JPS62247529A (en) * 1986-12-09 1987-10-28 Canon Inc Method for alignment
JPS62291133A (en) * 1986-06-11 1987-12-17 Nikon Corp Positioning method
JPS6313329A (en) * 1986-07-04 1988-01-20 Canon Inc Exposure device
JPS63250120A (en) * 1987-04-07 1988-10-18 Mitsubishi Electric Corp Alignment correction system
US4906852A (en) * 1988-03-10 1990-03-06 Hitachi, Ltd. Projection alignment method and apparatus
JPH0620921A (en) * 1992-09-18 1994-01-28 Hitachi Ltd Projection exposure method
JPH06151277A (en) * 1992-10-30 1994-05-31 Canon Inc Aligner
JPH0774095A (en) * 1994-06-20 1995-03-17 Nikon Corp Exposure equipment
JPH08241859A (en) * 1996-01-29 1996-09-17 Hitachi Ltd Projection exposure method
JPH08330394A (en) * 1996-06-13 1996-12-13 Nikon Corp Alignment method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109875A (en) * 1976-02-25 1977-09-14 Hitachi Ltd Position matching system for mask and wafer and its unit
JPS5352072A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Pattern for alignment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109875A (en) * 1976-02-25 1977-09-14 Hitachi Ltd Position matching system for mask and wafer and its unit
JPS5352072A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Pattern for alignment

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102823A (en) * 1980-01-19 1981-08-17 Nippon Kogaku Kk <Nikon> Positioning device
JPS5780724A (en) * 1980-11-07 1982-05-20 Nippon Kogaku Kk <Nikon> Positioning device
JPS57142612A (en) * 1981-02-27 1982-09-03 Nippon Kogaku Kk <Nikon> Alignment optical system of projection type exposure device
JPS5825638A (en) * 1981-08-08 1983-02-15 Canon Inc Exposing device
JPS5828748A (en) * 1981-08-13 1983-02-19 Nippon Kogaku Kk <Nikon> Positioning device for transcribing device
JPS5856330A (en) * 1981-09-30 1983-04-04 Hitachi Ltd Exposing device in contracted manner
JPS58165326A (en) * 1982-03-09 1983-09-30 ウロマスク Device for matching integrated circuit producing machine
JPS5927525A (en) * 1982-08-03 1984-02-14 Canon Inc Alignment method
JPS5994825A (en) * 1982-11-24 1984-05-31 Nec Corp Alignment method for semiconductor wafer
JPS59101829A (en) * 1982-12-01 1984-06-12 Canon Inc Arranging method of alignment mark
JPS6054437A (en) * 1983-09-05 1985-03-28 Hitachi Ltd Positioning method of wafer to reticle
JPS60102739A (en) * 1983-11-10 1985-06-06 Canon Inc Baking and exposure device for semiconductor
JPS60256002A (en) * 1984-06-01 1985-12-17 Nippon Kogaku Kk <Nikon> Position detecting apparatus
JPS60262423A (en) * 1984-06-11 1985-12-25 Nippon Kogaku Kk <Nikon> Position detector
JPS61123139A (en) * 1985-10-11 1986-06-11 Canon Inc Alignment apparatus
JPS62291133A (en) * 1986-06-11 1987-12-17 Nikon Corp Positioning method
JPS6313329A (en) * 1986-07-04 1988-01-20 Canon Inc Exposure device
JPS62169329A (en) * 1986-12-09 1987-07-25 Canon Inc Alignment method
JPS62247529A (en) * 1986-12-09 1987-10-28 Canon Inc Method for alignment
JPS63250120A (en) * 1987-04-07 1988-10-18 Mitsubishi Electric Corp Alignment correction system
US4906852A (en) * 1988-03-10 1990-03-06 Hitachi, Ltd. Projection alignment method and apparatus
JPH0620921A (en) * 1992-09-18 1994-01-28 Hitachi Ltd Projection exposure method
JPH06151277A (en) * 1992-10-30 1994-05-31 Canon Inc Aligner
JPH0774095A (en) * 1994-06-20 1995-03-17 Nikon Corp Exposure equipment
JPH08241859A (en) * 1996-01-29 1996-09-17 Hitachi Ltd Projection exposure method
JPH08330394A (en) * 1996-06-13 1996-12-13 Nikon Corp Alignment method

Also Published As

Publication number Publication date
JPS6227536B2 (en) 1987-06-15

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