JPS5547376A - Partially plating method for molded product of resin - Google Patents
Partially plating method for molded product of resinInfo
- Publication number
- JPS5547376A JPS5547376A JP11894278A JP11894278A JPS5547376A JP S5547376 A JPS5547376 A JP S5547376A JP 11894278 A JP11894278 A JP 11894278A JP 11894278 A JP11894278 A JP 11894278A JP S5547376 A JPS5547376 A JP S5547376A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded
- abs resin
- plating
- molding machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title abstract 9
- 239000011347 resin Substances 0.000 title abstract 9
- 238000007747 plating Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 3
- 238000000465 moulding Methods 0.000 abstract 3
- 239000002131 composite material Substances 0.000 abstract 2
- 238000001746 injection moulding Methods 0.000 abstract 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000010559 graft polymerization reaction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To manufacture a cmposite molded product of resins which has no thin stripes at the border between the resins, and has large difference in sensibility to plating, by molding the ABS resin with high impact styrene resin (HI resin) in such a manner that the ABS resin comes to the surface. CONSTITUTION:An HI resin such as a copolymer etc. which is made by the graft polymerization of styrene monomer with butadiene-styrene comonomer, and ABS resin are molded in the following way: The HI resin and ABS resin are molded using an injection molding machine for double molding, e.g., a multiple color, simultaneous molding machine, or a usual injection molding machine to form a composite molded resin in which ABS resin comes to the surface at portions which are to be plated partially. Then the composite molded resin is pretreated especially with high- chromium etching soln., then subjected to electroless plateing, electolytic plating by usual method to conduct partial plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11894278A JPS5547376A (en) | 1978-09-27 | 1978-09-27 | Partially plating method for molded product of resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11894278A JPS5547376A (en) | 1978-09-27 | 1978-09-27 | Partially plating method for molded product of resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5547376A true JPS5547376A (en) | 1980-04-03 |
Family
ID=14749042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11894278A Pending JPS5547376A (en) | 1978-09-27 | 1978-09-27 | Partially plating method for molded product of resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5547376A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827917A (en) * | 1971-08-13 | 1973-04-13 | ||
| JPS4828357A (en) * | 1971-08-05 | 1973-04-14 | ||
| JPS4930273A (en) * | 1972-07-20 | 1974-03-18 |
-
1978
- 1978-09-27 JP JP11894278A patent/JPS5547376A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828357A (en) * | 1971-08-05 | 1973-04-14 | ||
| JPS4827917A (en) * | 1971-08-13 | 1973-04-13 | ||
| JPS4930273A (en) * | 1972-07-20 | 1974-03-18 |
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