JPS5548242A - Hot-melt type heat-resistant resin composition - Google Patents
Hot-melt type heat-resistant resin compositionInfo
- Publication number
- JPS5548242A JPS5548242A JP12039678A JP12039678A JPS5548242A JP S5548242 A JPS5548242 A JP S5548242A JP 12039678 A JP12039678 A JP 12039678A JP 12039678 A JP12039678 A JP 12039678A JP S5548242 A JPS5548242 A JP S5548242A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy resin
- solvent
- hot
- imide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- 239000012943 hotmelt Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 3
- 239000004962 Polyamide-imide Substances 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 229920002312 polyamide-imide Polymers 0.000 abstract 2
- 239000004831 Hot glue Substances 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To provide the novel title composition of non-solvent type, having good heat resistance and bonding capability, and suitable for use in the base plates for electronic parts, electrical insulating films for thermocompression bonding, and hot-melt adhesives, which comprises an aromatic polyamide-imide and an epoxy resin each having specific characteristics.
CONSTITUTION: The objective composition comprising A) 100 parts by wt. of an aromatic polyamide-imide having a reduced viscosity of 0.1W1 and represented by the formula I, II, or III{Ar is a divalent residur of formulae IVWVI [R is H, halogen, or alkyl; X is O, S, carbonyl (oxy), or (dimethyl)-methylene]; Ar' is another divalent residue of formulae VIIWIX; n is a positive integer} B) 5W500 parts by wt. of an epoxy resin having two or more of epoxy groups in one molecule, and, if required, C) 0.05W100 parts by wt. of a curing agent for the epoxy resin. The blending operation of the three components is desired to be carried out by dissolving them in a solvent for the component A) e.g., dimethyl formamide, fallowed by removing the solvent.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039678A JPS5548242A (en) | 1978-10-02 | 1978-10-02 | Hot-melt type heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039678A JPS5548242A (en) | 1978-10-02 | 1978-10-02 | Hot-melt type heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5548242A true JPS5548242A (en) | 1980-04-05 |
| JPS5728510B2 JPS5728510B2 (en) | 1982-06-17 |
Family
ID=14785164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12039678A Granted JPS5548242A (en) | 1978-10-02 | 1978-10-02 | Hot-melt type heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5548242A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61218627A (en) * | 1985-03-23 | 1986-09-29 | Sumitomo Chem Co Ltd | Thermally curable heat-resistant resin composition |
| JPS63210120A (en) * | 1987-02-25 | 1988-08-31 | Toyobo Co Ltd | Heat-resistant film |
-
1978
- 1978-10-02 JP JP12039678A patent/JPS5548242A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61218627A (en) * | 1985-03-23 | 1986-09-29 | Sumitomo Chem Co Ltd | Thermally curable heat-resistant resin composition |
| JPS63210120A (en) * | 1987-02-25 | 1988-08-31 | Toyobo Co Ltd | Heat-resistant film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5728510B2 (en) | 1982-06-17 |
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